JP7812855B2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP7812855B2
JP7812855B2 JP2023529785A JP2023529785A JP7812855B2 JP 7812855 B2 JP7812855 B2 JP 7812855B2 JP 2023529785 A JP2023529785 A JP 2023529785A JP 2023529785 A JP2023529785 A JP 2023529785A JP 7812855 B2 JP7812855 B2 JP 7812855B2
Authority
JP
Japan
Prior art keywords
semiconductor elements
semiconductor
electrode
semiconductor device
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023529785A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022264844A5 (https=
JPWO2022264844A1 (https=
Inventor
幸太郎 柴田
昌明 松尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of JPWO2022264844A1 publication Critical patent/JPWO2022264844A1/ja
Publication of JPWO2022264844A5 publication Critical patent/JPWO2022264844A5/ja
Application granted granted Critical
Publication of JP7812855B2 publication Critical patent/JP7812855B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/08—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
JP2023529785A 2021-06-17 2022-06-06 半導体装置 Active JP7812855B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021100841 2021-06-17
JP2021100841 2021-06-17
PCT/JP2022/022702 WO2022264844A1 (ja) 2021-06-17 2022-06-06 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2022264844A1 JPWO2022264844A1 (https=) 2022-12-22
JPWO2022264844A5 JPWO2022264844A5 (https=) 2025-04-25
JP7812855B2 true JP7812855B2 (ja) 2026-02-10

Family

ID=84526402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023529785A Active JP7812855B2 (ja) 2021-06-17 2022-06-06 半導体装置

Country Status (5)

Country Link
US (1) US20240047367A1 (https=)
JP (1) JP7812855B2 (https=)
CN (1) CN117501446A (https=)
DE (1) DE112022002594T5 (https=)
WO (1) WO2022264844A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017175686A1 (ja) 2016-04-04 2017-10-12 ローム株式会社 パワーモジュールおよびその製造方法
WO2018056213A1 (ja) 2016-09-23 2018-03-29 三菱電機株式会社 電力用半導体モジュール及び電力用半導体装置
WO2018168924A1 (ja) 2017-03-14 2018-09-20 ローム株式会社 半導体装置
JP2018182330A (ja) 2017-04-20 2018-11-15 ローム株式会社 半導体装置
WO2019146073A1 (ja) 2018-01-26 2019-08-01 新電元工業株式会社 電子モジュール
WO2021059947A1 (ja) 2019-09-27 2021-04-01 ローム株式会社 半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016225493A (ja) 2015-06-01 2016-12-28 株式会社Ihi パワーモジュール
JP7267716B2 (ja) * 2018-11-12 2023-05-02 ローム株式会社 半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017175686A1 (ja) 2016-04-04 2017-10-12 ローム株式会社 パワーモジュールおよびその製造方法
WO2018056213A1 (ja) 2016-09-23 2018-03-29 三菱電機株式会社 電力用半導体モジュール及び電力用半導体装置
WO2018168924A1 (ja) 2017-03-14 2018-09-20 ローム株式会社 半導体装置
JP2018182330A (ja) 2017-04-20 2018-11-15 ローム株式会社 半導体装置
WO2019146073A1 (ja) 2018-01-26 2019-08-01 新電元工業株式会社 電子モジュール
WO2021059947A1 (ja) 2019-09-27 2021-04-01 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
US20240047367A1 (en) 2024-02-08
WO2022264844A1 (ja) 2022-12-22
CN117501446A (zh) 2024-02-02
JPWO2022264844A1 (https=) 2022-12-22
DE112022002594T5 (de) 2024-02-29

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