JPWO2022264844A1 - - Google Patents
Info
- Publication number
- JPWO2022264844A1 JPWO2022264844A1 JP2023529785A JP2023529785A JPWO2022264844A1 JP WO2022264844 A1 JPWO2022264844 A1 JP WO2022264844A1 JP 2023529785 A JP2023529785 A JP 2023529785A JP 2023529785 A JP2023529785 A JP 2023529785A JP WO2022264844 A1 JPWO2022264844 A1 JP WO2022264844A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/08—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
- H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021100841 | 2021-06-17 | ||
| JP2021100841 | 2021-06-17 | ||
| PCT/JP2022/022702 WO2022264844A1 (ja) | 2021-06-17 | 2022-06-06 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022264844A1 true JPWO2022264844A1 (https=) | 2022-12-22 |
| JPWO2022264844A5 JPWO2022264844A5 (https=) | 2025-04-25 |
| JP7812855B2 JP7812855B2 (ja) | 2026-02-10 |
Family
ID=84526402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023529785A Active JP7812855B2 (ja) | 2021-06-17 | 2022-06-06 | 半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240047367A1 (https=) |
| JP (1) | JP7812855B2 (https=) |
| CN (1) | CN117501446A (https=) |
| DE (1) | DE112022002594T5 (https=) |
| WO (1) | WO2022264844A1 (https=) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017175686A1 (ja) * | 2016-04-04 | 2017-10-12 | ローム株式会社 | パワーモジュールおよびその製造方法 |
| WO2018056213A1 (ja) * | 2016-09-23 | 2018-03-29 | 三菱電機株式会社 | 電力用半導体モジュール及び電力用半導体装置 |
| WO2018168924A1 (ja) * | 2017-03-14 | 2018-09-20 | ローム株式会社 | 半導体装置 |
| JP2018182330A (ja) * | 2017-04-20 | 2018-11-15 | ローム株式会社 | 半導体装置 |
| WO2019146073A1 (ja) * | 2018-01-26 | 2019-08-01 | 新電元工業株式会社 | 電子モジュール |
| JP2020080348A (ja) * | 2018-11-12 | 2020-05-28 | ローム株式会社 | 半導体装置 |
| WO2021059947A1 (ja) * | 2019-09-27 | 2021-04-01 | ローム株式会社 | 半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016225493A (ja) | 2015-06-01 | 2016-12-28 | 株式会社Ihi | パワーモジュール |
-
2022
- 2022-06-06 JP JP2023529785A patent/JP7812855B2/ja active Active
- 2022-06-06 WO PCT/JP2022/022702 patent/WO2022264844A1/ja not_active Ceased
- 2022-06-06 DE DE112022002594.8T patent/DE112022002594T5/de active Pending
- 2022-06-06 CN CN202280043181.9A patent/CN117501446A/zh active Pending
-
2023
- 2023-10-20 US US18/491,374 patent/US20240047367A1/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017175686A1 (ja) * | 2016-04-04 | 2017-10-12 | ローム株式会社 | パワーモジュールおよびその製造方法 |
| WO2018056213A1 (ja) * | 2016-09-23 | 2018-03-29 | 三菱電機株式会社 | 電力用半導体モジュール及び電力用半導体装置 |
| WO2018168924A1 (ja) * | 2017-03-14 | 2018-09-20 | ローム株式会社 | 半導体装置 |
| JP2018182330A (ja) * | 2017-04-20 | 2018-11-15 | ローム株式会社 | 半導体装置 |
| WO2019146073A1 (ja) * | 2018-01-26 | 2019-08-01 | 新電元工業株式会社 | 電子モジュール |
| JP2020080348A (ja) * | 2018-11-12 | 2020-05-28 | ローム株式会社 | 半導体装置 |
| WO2021059947A1 (ja) * | 2019-09-27 | 2021-04-01 | ローム株式会社 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7812855B2 (ja) | 2026-02-10 |
| US20240047367A1 (en) | 2024-02-08 |
| WO2022264844A1 (ja) | 2022-12-22 |
| CN117501446A (zh) | 2024-02-02 |
| DE112022002594T5 (de) | 2024-02-29 |
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