JPWO2024122343A5 - - Google Patents

Info

Publication number
JPWO2024122343A5
JPWO2024122343A5 JP2024562672A JP2024562672A JPWO2024122343A5 JP WO2024122343 A5 JPWO2024122343 A5 JP WO2024122343A5 JP 2024562672 A JP2024562672 A JP 2024562672A JP 2024562672 A JP2024562672 A JP 2024562672A JP WO2024122343 A5 JPWO2024122343 A5 JP WO2024122343A5
Authority
JP
Japan
Prior art keywords
reference temperature
wire
metal
semiconductor device
temperature detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024562672A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024122343A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/041986 external-priority patent/WO2024122343A1/ja
Publication of JPWO2024122343A1 publication Critical patent/JPWO2024122343A1/ja
Publication of JPWO2024122343A5 publication Critical patent/JPWO2024122343A5/ja
Pending legal-status Critical Current

Links

JP2024562672A 2022-12-07 2023-11-22 Pending JPWO2024122343A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022195593 2022-12-07
JP2023036276 2023-03-09
PCT/JP2023/041986 WO2024122343A1 (ja) 2022-12-07 2023-11-22 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024122343A1 JPWO2024122343A1 (https=) 2024-06-13
JPWO2024122343A5 true JPWO2024122343A5 (https=) 2025-08-18

Family

ID=91379269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024562672A Pending JPWO2024122343A1 (https=) 2022-12-07 2023-11-22

Country Status (2)

Country Link
JP (1) JPWO2024122343A1 (https=)
WO (1) WO2024122343A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025263387A1 (ja) * 2024-06-18 2025-12-26 ローム株式会社 半導体装置、および半導体モジュール

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4818895A (en) * 1987-11-13 1989-04-04 Kaufman Lance R Direct current sense lead
JPH02302634A (ja) * 1989-05-17 1990-12-14 Fujitsu Ltd 半導体集積回路の温度センサ
JP2009293986A (ja) * 2008-06-03 2009-12-17 Denso Corp 半導体装置
EP2302673A3 (de) * 2009-09-28 2016-05-25 SEMIKRON Elektronik GmbH & Co. KG Halbleiteranordnung und Verfahren zur Ermittlung der Sperrschichttemperatur eines Halbleiterbauelements

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