JPWO2024122343A1 - - Google Patents
Info
- Publication number
- JPWO2024122343A1 JPWO2024122343A1 JP2024562672A JP2024562672A JPWO2024122343A1 JP WO2024122343 A1 JPWO2024122343 A1 JP WO2024122343A1 JP 2024562672 A JP2024562672 A JP 2024562672A JP 2024562672 A JP2024562672 A JP 2024562672A JP WO2024122343 A1 JPWO2024122343 A1 JP WO2024122343A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022195593 | 2022-12-07 | ||
| JP2023036276 | 2023-03-09 | ||
| PCT/JP2023/041986 WO2024122343A1 (ja) | 2022-12-07 | 2023-11-22 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024122343A1 true JPWO2024122343A1 (https=) | 2024-06-13 |
| JPWO2024122343A5 JPWO2024122343A5 (https=) | 2025-08-18 |
Family
ID=91379269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024562672A Pending JPWO2024122343A1 (https=) | 2022-12-07 | 2023-11-22 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024122343A1 (https=) |
| WO (1) | WO2024122343A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025263387A1 (ja) * | 2024-06-18 | 2025-12-26 | ローム株式会社 | 半導体装置、および半導体モジュール |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4818895A (en) * | 1987-11-13 | 1989-04-04 | Kaufman Lance R | Direct current sense lead |
| JPH02302634A (ja) * | 1989-05-17 | 1990-12-14 | Fujitsu Ltd | 半導体集積回路の温度センサ |
| JP2009293986A (ja) * | 2008-06-03 | 2009-12-17 | Denso Corp | 半導体装置 |
| EP2302673A3 (de) * | 2009-09-28 | 2016-05-25 | SEMIKRON Elektronik GmbH & Co. KG | Halbleiteranordnung und Verfahren zur Ermittlung der Sperrschichttemperatur eines Halbleiterbauelements |
-
2023
- 2023-11-22 WO PCT/JP2023/041986 patent/WO2024122343A1/ja not_active Ceased
- 2023-11-22 JP JP2024562672A patent/JPWO2024122343A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024122343A1 (ja) | 2024-06-13 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250416 |