JPWO2024122399A5 - - Google Patents

Info

Publication number
JPWO2024122399A5
JPWO2024122399A5 JP2024562703A JP2024562703A JPWO2024122399A5 JP WO2024122399 A5 JPWO2024122399 A5 JP WO2024122399A5 JP 2024562703 A JP2024562703 A JP 2024562703A JP 2024562703 A JP2024562703 A JP 2024562703A JP WO2024122399 A5 JPWO2024122399 A5 JP WO2024122399A5
Authority
JP
Japan
Prior art keywords
reference temperature
wire
metal
semiconductor device
temperature detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024562703A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024122399A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/042497 external-priority patent/WO2024122399A1/ja
Publication of JPWO2024122399A1 publication Critical patent/JPWO2024122399A1/ja
Publication of JPWO2024122399A5 publication Critical patent/JPWO2024122399A5/ja
Pending legal-status Critical Current

Links

JP2024562703A 2022-12-07 2023-11-28 Pending JPWO2024122399A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022195594 2022-12-07
JP2023036276 2023-03-09
PCT/JP2023/042497 WO2024122399A1 (ja) 2022-12-07 2023-11-28 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024122399A1 JPWO2024122399A1 (https=) 2024-06-13
JPWO2024122399A5 true JPWO2024122399A5 (https=) 2025-08-18

Family

ID=91379338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024562703A Pending JPWO2024122399A1 (https=) 2022-12-07 2023-11-28

Country Status (2)

Country Link
JP (1) JPWO2024122399A1 (https=)
WO (1) WO2024122399A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4818895A (en) * 1987-11-13 1989-04-04 Kaufman Lance R Direct current sense lead
JPH02302634A (ja) * 1989-05-17 1990-12-14 Fujitsu Ltd 半導体集積回路の温度センサ
JP2009293986A (ja) * 2008-06-03 2009-12-17 Denso Corp 半導体装置
EP2302673A3 (de) * 2009-09-28 2016-05-25 SEMIKRON Elektronik GmbH & Co. KG Halbleiteranordnung und Verfahren zur Ermittlung der Sperrschichttemperatur eines Halbleiterbauelements

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