JP7067205B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP7067205B2 JP7067205B2 JP2018070720A JP2018070720A JP7067205B2 JP 7067205 B2 JP7067205 B2 JP 7067205B2 JP 2018070720 A JP2018070720 A JP 2018070720A JP 2018070720 A JP2018070720 A JP 2018070720A JP 7067205 B2 JP7067205 B2 JP 7067205B2
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- H01L23/367—Cooling facilitated by shape of device
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- G01K3/00—Thermometers giving results other than momentary value of temperature
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- Semiconductor Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
特許文献1 特開2006-237331号公報
Claims (13)
- 筐体と、
放熱基板と、
前記放熱基板上に設けられた第1の半導体チップと、
前記筐体上に設けられた温度検出部と、
前記第1の半導体チップと前記温度検出部とを電気的に接続する第1の熱電部材と、
前記第1の半導体チップと前記温度検出部とを電気的に接続し、前記第1の熱電部材と異なる材料の第2の熱電部材と
を備え、
前記放熱基板の熱伝導率は、前記筐体の熱伝導率よりも高い
半導体装置。 - 前記第1の半導体チップは、前記第1の熱電部材および前記第2の熱電部材が接続される、第1の導電性パッドを有する、
請求項1に記載の半導体装置。 - 前記温度検出部は、温度検出素子を有し、前記温度検出部の温度と、前記第1の半導体チップの温度との温度差に基づいて、前記第1の半導体チップの温度を検出する、
請求項1または2に記載の半導体装置。 - 前記温度検出部は、前記第1の熱電部材と前記第2の熱電部材とに接続された第2の導電性パッドを有する、
請求項1から3のいずれか一項に記載の半導体装置。 - 前記第1の半導体チップと前記温度検出部との間には、前記放熱基板よりも熱伝導率の低い材料が設けられる、請求項1から4のいずれか一項に記載の半導体装置。
- 前記筐体は、前記放熱基板の上面と異なる平面上に上面を有する
請求項1から5のいずれか一項に記載の半導体装置。 - 前記第1の半導体チップと前記放熱基板との間に設けられた第1のリードフレームと、
前記温度検出部と前記筐体との間に設けられた第2のリードフレームとを更に備え、
前記第1のリードフレームと前記第2のリードフレームとの間には、前記放熱基板よりも熱伝導率の低い材料が設けられる、請求項1から6のいずれか一項に記載の半導体装置。 - 前記第1の熱電部材は、銅、およびニッケル-クロム合金のうちの少なくとも1つを有する、
請求項1から7のいずれか一項に記載の半導体装置。 - 前記第2の熱電部材は、銅-ニッケル合金、およびニッケル合金のうちの少なくとも1つを有する、
請求項1から8のいずれか一項に記載の半導体装置。 - 前記第1の半導体チップは、ダイオード部およびトランジスタ部を含み、
前記第1の導電性パッドは、前記ダイオード部に設けられる、
請求項2に記載の半導体装置。 - 前記トランジスタ部は、エミッタ電極を含み、
前記第1の導電性パッドおよび前記エミッタ電極は、同一の材料により設けられる、
請求項10に記載の半導体装置。 - 前記第1の半導体チップは、前記ダイオード部および前記トランジスタ部にわたるエミッタ電極を含み、
前記第1の導電性パッドは、前記ダイオード部における前記エミッタ電極の上方に設けられる、
請求項10に記載の半導体装置。 - ダイオード部を含む第2の半導体チップをさらに備え、
前記第1の半導体チップは、トランジスタ部を有し、
前記第1の導電性パッドは、前記トランジスタ部に設けられる、
請求項2に記載の半導体装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2018070720A JP7067205B2 (ja) | 2018-04-02 | 2018-04-02 | 半導体装置 |
US16/288,104 US10957619B2 (en) | 2018-04-02 | 2019-02-28 | Semiconductor apparatus |
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JP2018070720A JP7067205B2 (ja) | 2018-04-02 | 2018-04-02 | 半導体装置 |
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JP2019186239A JP2019186239A (ja) | 2019-10-24 |
JP7067205B2 true JP7067205B2 (ja) | 2022-05-16 |
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JP (1) | JP7067205B2 (ja) |
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JP7322654B2 (ja) * | 2019-10-15 | 2023-08-08 | 富士電機株式会社 | 半導体モジュール |
JP7491066B2 (ja) | 2020-06-04 | 2024-05-28 | 富士電機株式会社 | 半導体装置 |
DE102022210310A1 (de) | 2022-09-29 | 2024-04-04 | Robert Bosch Gesellschaft mit beschränkter Haftung | Vorrichtung zur Erfassung einer Temperaturdifferenz sowie Bestimmungsverfahren |
Citations (4)
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JP2008147683A (ja) | 2007-12-21 | 2008-06-26 | Mitsubishi Electric Corp | 半導体装置 |
JP2015002229A (ja) | 2013-06-14 | 2015-01-05 | ルネサスエレクトロニクス株式会社 | 半導体装置および電子装置 |
JP2016046424A (ja) | 2014-08-25 | 2016-04-04 | トヨタ自動車株式会社 | 半導体装置 |
US20160293497A1 (en) | 2015-03-30 | 2016-10-06 | International Business Machines Corporation | Soldering three dimensional integrated circuits |
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JPH0714948A (ja) | 1993-06-15 | 1995-01-17 | Hitachi Ltd | パワー半導体モジュール |
JP4677756B2 (ja) | 2004-10-13 | 2011-04-27 | 富士電機システムズ株式会社 | パワーモジュール |
JP2006237331A (ja) | 2005-02-25 | 2006-09-07 | Nissan Motor Co Ltd | 過温度検出回路及び過温度保護回路 |
JP5233198B2 (ja) | 2007-08-06 | 2013-07-10 | 富士電機株式会社 | 半導体装置 |
JP5012737B2 (ja) | 2007-09-05 | 2012-08-29 | 株式会社デンソー | 半導体装置 |
JP2009293986A (ja) | 2008-06-03 | 2009-12-17 | Denso Corp | 半導体装置 |
MX2014002608A (es) | 2011-09-07 | 2014-04-14 | Toyota Motor Co Ltd | Dispositivo semiconductor y metodo para fabricar el mismo. |
JP6127820B2 (ja) | 2013-08-02 | 2017-05-17 | トヨタ自動車株式会社 | 半導体装置 |
JP5918288B2 (ja) | 2014-03-03 | 2016-05-18 | トヨタ自動車株式会社 | 半導体装置 |
JP2016012647A (ja) | 2014-06-27 | 2016-01-21 | トヨタ自動車株式会社 | 半導体装置 |
JP6668697B2 (ja) | 2015-05-15 | 2020-03-18 | 富士電機株式会社 | 半導体装置 |
-
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- 2018-04-02 JP JP2018070720A patent/JP7067205B2/ja active Active
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- 2019-02-28 US US16/288,104 patent/US10957619B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008147683A (ja) | 2007-12-21 | 2008-06-26 | Mitsubishi Electric Corp | 半導体装置 |
JP2015002229A (ja) | 2013-06-14 | 2015-01-05 | ルネサスエレクトロニクス株式会社 | 半導体装置および電子装置 |
JP2016046424A (ja) | 2014-08-25 | 2016-04-04 | トヨタ自動車株式会社 | 半導体装置 |
US20160293497A1 (en) | 2015-03-30 | 2016-10-06 | International Business Machines Corporation | Soldering three dimensional integrated circuits |
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US20190304867A1 (en) | 2019-10-03 |
JP2019186239A (ja) | 2019-10-24 |
US10957619B2 (en) | 2021-03-23 |
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