JPWO2023053823A5 - - Google Patents

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Publication number
JPWO2023053823A5
JPWO2023053823A5 JP2023550479A JP2023550479A JPWO2023053823A5 JP WO2023053823 A5 JPWO2023053823 A5 JP WO2023053823A5 JP 2023550479 A JP2023550479 A JP 2023550479A JP 2023550479 A JP2023550479 A JP 2023550479A JP WO2023053823 A5 JPWO2023053823 A5 JP WO2023053823A5
Authority
JP
Japan
Prior art keywords
conductor
semiconductor elements
semiconductor device
electrode
thickness direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023550479A
Other languages
English (en)
Japanese (ja)
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JPWO2023053823A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/032604 external-priority patent/WO2023053823A1/ja
Publication of JPWO2023053823A1 publication Critical patent/JPWO2023053823A1/ja
Publication of JPWO2023053823A5 publication Critical patent/JPWO2023053823A5/ja
Pending legal-status Critical Current

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JP2023550479A 2021-09-29 2022-08-30 Pending JPWO2023053823A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021159368 2021-09-29
PCT/JP2022/032604 WO2023053823A1 (ja) 2021-09-29 2022-08-30 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023053823A1 JPWO2023053823A1 (https=) 2023-04-06
JPWO2023053823A5 true JPWO2023053823A5 (https=) 2024-06-14

Family

ID=85780595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023550479A Pending JPWO2023053823A1 (https=) 2021-09-29 2022-08-30

Country Status (5)

Country Link
US (1) US20240186256A1 (https=)
JP (1) JPWO2023053823A1 (https=)
CN (1) CN118020155A (https=)
DE (1) DE112022004169T5 (https=)
WO (1) WO2023053823A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4567881A1 (en) * 2023-12-04 2025-06-11 Hunan San'an Semiconductor Co., Ltd. Power semiconductor module, power semiconductor module heat dissipation packaging structure, and electrode controller
WO2025177812A1 (ja) * 2024-02-20 2025-08-28 ローム株式会社 半導体装置
WO2026023121A1 (ja) * 2024-07-22 2026-01-29 株式会社 東芝 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104380462B (zh) * 2012-06-01 2017-05-24 松下知识产权经营株式会社 功率半导体装置
DE112017001838T5 (de) * 2016-04-04 2018-12-20 Rohm Co., Ltd. Leistungsmodul und Herstellungsverfahren dafür
CN111418049B (zh) * 2018-06-06 2023-12-08 富士电机株式会社 半导体装置
JP7428018B2 (ja) * 2020-03-06 2024-02-06 富士電機株式会社 半導体モジュール

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