JPWO2023053823A5 - - Google Patents

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Publication number
JPWO2023053823A5
JPWO2023053823A5 JP2023550479A JP2023550479A JPWO2023053823A5 JP WO2023053823 A5 JPWO2023053823 A5 JP WO2023053823A5 JP 2023550479 A JP2023550479 A JP 2023550479A JP 2023550479 A JP2023550479 A JP 2023550479A JP WO2023053823 A5 JPWO2023053823 A5 JP WO2023053823A5
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JP
Japan
Prior art keywords
conductor
semiconductor elements
semiconductor device
electrode
thickness direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023550479A
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English (en)
Japanese (ja)
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JPWO2023053823A1 (https=
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Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/032604 external-priority patent/WO2023053823A1/ja
Publication of JPWO2023053823A1 publication Critical patent/JPWO2023053823A1/ja
Publication of JPWO2023053823A5 publication Critical patent/JPWO2023053823A5/ja
Pending legal-status Critical Current

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JP2023550479A 2021-09-29 2022-08-30 Pending JPWO2023053823A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021159368 2021-09-29
PCT/JP2022/032604 WO2023053823A1 (ja) 2021-09-29 2022-08-30 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023053823A1 JPWO2023053823A1 (https=) 2023-04-06
JPWO2023053823A5 true JPWO2023053823A5 (https=) 2024-06-14

Family

ID=85780595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023550479A Pending JPWO2023053823A1 (https=) 2021-09-29 2022-08-30

Country Status (5)

Country Link
US (1) US20240186256A1 (https=)
JP (1) JPWO2023053823A1 (https=)
CN (1) CN118020155A (https=)
DE (1) DE112022004169T5 (https=)
WO (1) WO2023053823A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4567881A1 (en) * 2023-12-04 2025-06-11 Hunan San'an Semiconductor Co., Ltd. Power semiconductor module, power semiconductor module heat dissipation packaging structure, and electrode controller
WO2025177812A1 (ja) * 2024-02-20 2025-08-28 ローム株式会社 半導体装置
WO2026023121A1 (ja) * 2024-07-22 2026-01-29 株式会社 東芝 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013179547A1 (ja) * 2012-06-01 2013-12-05 パナソニック株式会社 パワー半導体装置
JPWO2017175686A1 (ja) * 2016-04-04 2019-02-14 ローム株式会社 パワーモジュールおよびその製造方法
JP6888742B2 (ja) * 2018-06-06 2021-06-16 富士電機株式会社 半導体装置
JP7428018B2 (ja) * 2020-03-06 2024-02-06 富士電機株式会社 半導体モジュール

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