JPWO2024176851A5 - - Google Patents

Info

Publication number
JPWO2024176851A5
JPWO2024176851A5 JP2025502267A JP2025502267A JPWO2024176851A5 JP WO2024176851 A5 JPWO2024176851 A5 JP WO2024176851A5 JP 2025502267 A JP2025502267 A JP 2025502267A JP 2025502267 A JP2025502267 A JP 2025502267A JP WO2024176851 A5 JPWO2024176851 A5 JP WO2024176851A5
Authority
JP
Japan
Prior art keywords
semiconductor device
thickness direction
thin
main surface
main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025502267A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024176851A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/004262 external-priority patent/WO2024176851A1/ja
Publication of JPWO2024176851A1 publication Critical patent/JPWO2024176851A1/ja
Publication of JPWO2024176851A5 publication Critical patent/JPWO2024176851A5/ja
Pending legal-status Critical Current

Links

JP2025502267A 2023-02-24 2024-02-08 Pending JPWO2024176851A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023027193 2023-02-24
PCT/JP2024/004262 WO2024176851A1 (ja) 2023-02-24 2024-02-08 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024176851A1 JPWO2024176851A1 (https=) 2024-08-29
JPWO2024176851A5 true JPWO2024176851A5 (https=) 2025-11-06

Family

ID=92500742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025502267A Pending JPWO2024176851A1 (https=) 2023-02-24 2024-02-08

Country Status (4)

Country Link
US (1) US20250372484A1 (https=)
JP (1) JPWO2024176851A1 (https=)
CN (1) CN120677566A (https=)
WO (1) WO2024176851A1 (https=)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112019001917T5 (de) * 2018-04-11 2020-12-24 Rohm Co., Ltd. Halbleiterbauteil

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