JPWO2024038746A5 - - Google Patents
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- Publication number
- JPWO2024038746A5 JPWO2024038746A5 JP2024541476A JP2024541476A JPWO2024038746A5 JP WO2024038746 A5 JPWO2024038746 A5 JP WO2024038746A5 JP 2024541476 A JP2024541476 A JP 2024541476A JP 2024541476 A JP2024541476 A JP 2024541476A JP WO2024038746 A5 JPWO2024038746 A5 JP WO2024038746A5
- Authority
- JP
- Japan
- Prior art keywords
- opening
- die pad
- semiconductor device
- main surface
- pad portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 23
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022131067 | 2022-08-19 | ||
| PCT/JP2023/027378 WO2024038746A1 (ja) | 2022-08-19 | 2023-07-26 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024038746A1 JPWO2024038746A1 (https=) | 2024-02-22 |
| JPWO2024038746A5 true JPWO2024038746A5 (https=) | 2025-04-28 |
Family
ID=89941515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024541476A Pending JPWO2024038746A1 (https=) | 2022-08-19 | 2023-07-26 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024038746A1 (https=) |
| WO (1) | WO2024038746A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6832094B2 (ja) * | 2016-08-05 | 2021-02-24 | ローム株式会社 | パワーモジュール及びモータ駆動回路 |
| JP2019114618A (ja) * | 2017-12-22 | 2019-07-11 | 株式会社デンソー | 半導体装置 |
| JP7548714B2 (ja) * | 2019-03-25 | 2024-09-10 | ローム株式会社 | 電子装置、電子装置の製造方法、およびリードフレーム |
| US20240112995A1 (en) * | 2020-12-24 | 2024-04-04 | Rohm Co., Ltd. | Semiconductor equipment |
| DE112021006381B4 (de) * | 2021-01-04 | 2024-05-29 | Rohm Co., Ltd. | Halbleiterbauteil |
-
2023
- 2023-07-26 WO PCT/JP2023/027378 patent/WO2024038746A1/ja not_active Ceased
- 2023-07-26 JP JP2024541476A patent/JPWO2024038746A1/ja active Pending