JPWO2023100759A5 - - Google Patents
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- Publication number
- JPWO2023100759A5 JPWO2023100759A5 JP2023564933A JP2023564933A JPWO2023100759A5 JP WO2023100759 A5 JPWO2023100759 A5 JP WO2023100759A5 JP 2023564933 A JP2023564933 A JP 2023564933A JP 2023564933 A JP2023564933 A JP 2023564933A JP WO2023100759 A5 JPWO2023100759 A5 JP WO2023100759A5
- Authority
- JP
- Japan
- Prior art keywords
- thickness direction
- semiconductor device
- resin
- lead
- resin surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 23
- 229920005989 resin Polymers 0.000 claims 23
- 239000004065 semiconductor Substances 0.000 claims 20
- 238000007789 sealing Methods 0.000 claims 9
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021195180 | 2021-12-01 | ||
| PCT/JP2022/043515 WO2023100759A1 (ja) | 2021-12-01 | 2022-11-25 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023100759A1 JPWO2023100759A1 (https=) | 2023-06-08 |
| JPWO2023100759A5 true JPWO2023100759A5 (https=) | 2024-08-16 |
Family
ID=86612123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023564933A Pending JPWO2023100759A1 (https=) | 2021-12-01 | 2022-11-25 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240282677A1 (https=) |
| JP (1) | JPWO2023100759A1 (https=) |
| CN (1) | CN118355489A (https=) |
| DE (1) | DE112022004054T5 (https=) |
| WO (1) | WO2023100759A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63283052A (ja) * | 1987-05-14 | 1988-11-18 | Mitsubishi Electric Corp | 集積回路用パツケ−ジ |
| JP3117828B2 (ja) * | 1992-12-28 | 2000-12-18 | ローム株式会社 | 合成樹脂封止型電子部品及びそのリード端子の曲げ加工方法 |
| JP2000133761A (ja) * | 1998-08-20 | 2000-05-12 | Fujitsu Ltd | 半導体装置及びその製造方法 |
| DE102017202770B4 (de) * | 2016-08-31 | 2023-06-07 | Infineon Technologies Austria Ag | Halbleiterchipgehäuse mit einem sich wiederholenden Grundflächenmuster |
| JP2019129228A (ja) * | 2018-01-24 | 2019-08-01 | トヨタ自動車株式会社 | 半導体装置及びその製造方法 |
| WO2020059751A1 (ja) * | 2018-09-19 | 2020-03-26 | ローム株式会社 | 半導体装置 |
-
2022
- 2022-11-25 CN CN202280078483.XA patent/CN118355489A/zh active Pending
- 2022-11-25 DE DE112022004054.8T patent/DE112022004054T5/de active Pending
- 2022-11-25 JP JP2023564933A patent/JPWO2023100759A1/ja active Pending
- 2022-11-25 WO PCT/JP2022/043515 patent/WO2023100759A1/ja not_active Ceased
-
2024
- 2024-04-30 US US18/650,970 patent/US20240282677A1/en active Pending