JPWO2023032555A5 - - Google Patents

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Publication number
JPWO2023032555A5
JPWO2023032555A5 JP2023545168A JP2023545168A JPWO2023032555A5 JP WO2023032555 A5 JPWO2023032555 A5 JP WO2023032555A5 JP 2023545168 A JP2023545168 A JP 2023545168A JP 2023545168 A JP2023545168 A JP 2023545168A JP WO2023032555 A5 JPWO2023032555 A5 JP WO2023032555A5
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JP
Japan
Prior art keywords
resin
transparent resin
semiconductor device
main surface
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023545168A
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English (en)
Japanese (ja)
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JPWO2023032555A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/029515 external-priority patent/WO2023032555A1/ja
Publication of JPWO2023032555A1 publication Critical patent/JPWO2023032555A1/ja
Publication of JPWO2023032555A5 publication Critical patent/JPWO2023032555A5/ja
Pending legal-status Critical Current

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JP2023545168A 2021-08-30 2022-08-01 Pending JPWO2023032555A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021139780 2021-08-30
PCT/JP2022/029515 WO2023032555A1 (ja) 2021-08-30 2022-08-01 半導体装置、および、半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2023032555A1 JPWO2023032555A1 (https=) 2023-03-09
JPWO2023032555A5 true JPWO2023032555A5 (https=) 2024-05-23

Family

ID=85410999

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023545168A Pending JPWO2023032555A1 (https=) 2021-08-30 2022-08-01

Country Status (5)

Country Link
US (1) US20240194660A1 (https=)
JP (1) JPWO2023032555A1 (https=)
CN (1) CN117882201A (https=)
DE (1) DE112022004213T5 (https=)
WO (1) WO2023032555A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10116940A (ja) * 1996-10-09 1998-05-06 Toshiba Corp 樹脂封止型半導体装置及びその製造方法
JP2002344006A (ja) * 2001-05-15 2002-11-29 Sharp Corp 光結合装置
JP5381280B2 (ja) * 2009-04-23 2014-01-08 オムロン株式会社 光結合装置
TWI525767B (zh) * 2011-04-04 2016-03-11 羅姆電子股份有限公司 Semiconductor device and method for manufacturing semiconductor device
JP6429621B2 (ja) * 2014-02-18 2018-11-28 エイブリック株式会社 光センサ装置および光センサ装置の製造方法
DE102016105243A1 (de) * 2016-03-21 2017-09-21 Infineon Technologies Ag Räumlich Selektives Aufrauen von Verkapselungsmasse, um eine Haftung mit einer Funktionsstruktur zu Fördern

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