KR100657159B1 - 반도체 패키지 제조용 몰드 구조 - Google Patents
반도체 패키지 제조용 몰드 구조 Download PDFInfo
- Publication number
- KR100657159B1 KR100657159B1 KR1020050033920A KR20050033920A KR100657159B1 KR 100657159 B1 KR100657159 B1 KR 100657159B1 KR 1020050033920 A KR1020050033920 A KR 1020050033920A KR 20050033920 A KR20050033920 A KR 20050033920A KR 100657159 B1 KR100657159 B1 KR 100657159B1
- Authority
- KR
- South Korea
- Prior art keywords
- mold
- semiconductor package
- inner lead
- chip mounting
- mounting plate
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C9/00—Reinforcements or ply arrangement of pneumatic tyres
- B60C9/18—Structure or arrangement of belts or breakers, crown-reinforcing or cushioning layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C9/00—Reinforcements or ply arrangement of pneumatic tyres
- B60C9/18—Structure or arrangement of belts or breakers, crown-reinforcing or cushioning layers
- B60C9/1835—Rubber strips or cushions at the belt edges
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C9/00—Reinforcements or ply arrangement of pneumatic tyres
- B60C9/18—Structure or arrangement of belts or breakers, crown-reinforcing or cushioning layers
- B60C2009/1878—Structure or arrangement of belts or breakers, crown-reinforcing or cushioning layers with flat cushions or shear layers between the carcass and the belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
상기 돌출면의 칩탑재판이 안착되는 구간은 직선의 평면으로 형성되고, 인너리드가 안착되는 구간은 경사면으로 형성된 것을 특징으로 하는 반도체 패키지 제조용 몰드 구조를 제공한다.
Claims (3)
- 삭제
- 핀게이트 및 캐비티를 갖는 탑 몰드와, 반도체 패키지가 안착되는 바텀 몰드와, 이 바텀몰드의 상면에 리드프레임의 칩탑재판과 인너리드가 위쪽으로 상승되도록 형성된 돌출면을 포함하는 리드프레임을 이용한 반도체 패키지 제조용 몰드 구조에 있어서,상기 돌출면의 칩탑재판이 안착되는 구간은 직선의 평면으로 형성되고, 인너리드가 안착되는 구간은 경사면으로 형성된 것을 특징으로 하는 반도체 패키지 제조용 몰드 구조.
- 청구항 2에 있어서, 상기 돌출면의 높이는 칩탑재판과 인너리드에 변형이 발생되지 않을 정도인 10∼20㎛ 인 것을 특징으로 하는 반도체 패키지 제조용 몰드 구조.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020050033920A KR100657159B1 (ko) | 2005-04-25 | 2005-04-25 | 반도체 패키지 제조용 몰드 구조 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020050033920A KR100657159B1 (ko) | 2005-04-25 | 2005-04-25 | 반도체 패키지 제조용 몰드 구조 |
Publications (2)
Publication Number | Publication Date |
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KR20060111937A KR20060111937A (ko) | 2006-10-31 |
KR100657159B1 true KR100657159B1 (ko) | 2006-12-13 |
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KR1020050033920A KR100657159B1 (ko) | 2005-04-25 | 2005-04-25 | 반도체 패키지 제조용 몰드 구조 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100693739B1 (ko) * | 2006-03-28 | 2007-03-12 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 제조용 리드프레임 |
KR101101568B1 (ko) * | 2009-11-20 | 2012-01-02 | 삼성전기주식회사 | 고주파 패키지 제조 방법 및 이에 의해 제조되는 고주파 패키지 |
KR101688079B1 (ko) * | 2015-07-13 | 2016-12-20 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 및 이의 제조 방법 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020079211A (ko) * | 2001-04-13 | 2002-10-19 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 제조용 몰딩 금형 및 이것을 이용한 반도체패키지 몰딩방법 |
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- 2005-04-25 KR KR1020050033920A patent/KR100657159B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20020079211A (ko) * | 2001-04-13 | 2002-10-19 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 제조용 몰딩 금형 및 이것을 이용한 반도체패키지 몰딩방법 |
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KR20060111937A (ko) | 2006-10-31 |
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