JPWO2023100731A5 - - Google Patents
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- Publication number
- JPWO2023100731A5 JPWO2023100731A5 JP2023564910A JP2023564910A JPWO2023100731A5 JP WO2023100731 A5 JPWO2023100731 A5 JP WO2023100731A5 JP 2023564910 A JP2023564910 A JP 2023564910A JP 2023564910 A JP2023564910 A JP 2023564910A JP WO2023100731 A5 JPWO2023100731 A5 JP WO2023100731A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- thickness direction
- lead
- surface facing
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 20
- 239000011347 resin Substances 0.000 claims 12
- 229920005989 resin Polymers 0.000 claims 12
- 238000007789 sealing Methods 0.000 claims 3
- 230000000149 penetrating effect Effects 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021195179 | 2021-12-01 | ||
| PCT/JP2022/043282 WO2023100731A1 (ja) | 2021-12-01 | 2022-11-24 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023100731A1 JPWO2023100731A1 (https=) | 2023-06-08 |
| JPWO2023100731A5 true JPWO2023100731A5 (https=) | 2024-08-15 |
Family
ID=86612131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023564910A Pending JPWO2023100731A1 (https=) | 2021-12-01 | 2022-11-24 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240282678A1 (https=) |
| JP (1) | JPWO2023100731A1 (https=) |
| CN (1) | CN118318302A (https=) |
| DE (1) | DE112022005255T5 (https=) |
| WO (1) | WO2023100731A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04134857U (ja) * | 1991-06-07 | 1992-12-15 | 日本電気株式会社 | 表面実装型半導体装置 |
| JP2009130044A (ja) * | 2007-11-21 | 2009-06-11 | Denso Corp | 半導体装置の製造方法 |
| JP6653199B2 (ja) | 2016-03-23 | 2020-02-26 | ローム株式会社 | 半導体装置 |
| US11631623B2 (en) * | 2018-09-06 | 2023-04-18 | Mitsubishi Electric Corporation | Power semiconductor device and method of manufacturing the same, and power conversion device |
| JP2020136331A (ja) * | 2019-02-14 | 2020-08-31 | 株式会社日産アーク | 半導体装置及びその製造方法 |
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2022
- 2022-11-24 JP JP2023564910A patent/JPWO2023100731A1/ja active Pending
- 2022-11-24 WO PCT/JP2022/043282 patent/WO2023100731A1/ja not_active Ceased
- 2022-11-24 DE DE112022005255.4T patent/DE112022005255T5/de active Pending
- 2022-11-24 CN CN202280079017.3A patent/CN118318302A/zh active Pending
-
2024
- 2024-04-30 US US18/651,064 patent/US20240282678A1/en active Pending