JPWO2024004614A5 - - Google Patents

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Publication number
JPWO2024004614A5
JPWO2024004614A5 JP2024530652A JP2024530652A JPWO2024004614A5 JP WO2024004614 A5 JPWO2024004614 A5 JP WO2024004614A5 JP 2024530652 A JP2024530652 A JP 2024530652A JP 2024530652 A JP2024530652 A JP 2024530652A JP WO2024004614 A5 JPWO2024004614 A5 JP WO2024004614A5
Authority
JP
Japan
Prior art keywords
die pad
terminal lead
semiconductor device
thickness direction
surface electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024530652A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024004614A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/021725 external-priority patent/WO2024004614A1/ja
Publication of JPWO2024004614A1 publication Critical patent/JPWO2024004614A1/ja
Publication of JPWO2024004614A5 publication Critical patent/JPWO2024004614A5/ja
Pending legal-status Critical Current

Links

JP2024530652A 2022-06-28 2023-06-12 Pending JPWO2024004614A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022103500 2022-06-28
PCT/JP2023/021725 WO2024004614A1 (ja) 2022-06-28 2023-06-12 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024004614A1 JPWO2024004614A1 (https=) 2024-01-04
JPWO2024004614A5 true JPWO2024004614A5 (https=) 2025-03-12

Family

ID=89382013

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024530652A Pending JPWO2024004614A1 (https=) 2022-06-28 2023-06-12

Country Status (2)

Country Link
JP (1) JPWO2024004614A1 (https=)
WO (1) WO2024004614A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4471967B2 (ja) * 2006-12-28 2010-06-02 株式会社ルネサステクノロジ 双方向スイッチモジュール
JP5172290B2 (ja) * 2007-11-21 2013-03-27 ローム株式会社 半導体装置
DE112021002909T5 (de) * 2020-06-23 2023-03-09 Rohm Co., Ltd. Halbleiterbauteil
JP7758673B2 (ja) * 2020-07-28 2025-10-22 ローム株式会社 半導体装置
JP2022025587A (ja) * 2020-07-29 2022-02-10 ローム株式会社 半導体装置

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