JPWO2025013528A5 - - Google Patents

Info

Publication number
JPWO2025013528A5
JPWO2025013528A5 JP2025532461A JP2025532461A JPWO2025013528A5 JP WO2025013528 A5 JPWO2025013528 A5 JP WO2025013528A5 JP 2025532461 A JP2025532461 A JP 2025532461A JP 2025532461 A JP2025532461 A JP 2025532461A JP WO2025013528 A5 JPWO2025013528 A5 JP WO2025013528A5
Authority
JP
Japan
Prior art keywords
thickness direction
chip
electronic device
mounting
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025532461A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025013528A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/021855 external-priority patent/WO2025013528A1/ja
Publication of JPWO2025013528A1 publication Critical patent/JPWO2025013528A1/ja
Publication of JPWO2025013528A5 publication Critical patent/JPWO2025013528A5/ja
Pending legal-status Critical Current

Links

JP2025532461A 2023-07-11 2024-06-17 Pending JPWO2025013528A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023113600 2023-07-11
PCT/JP2024/021855 WO2025013528A1 (ja) 2023-07-11 2024-06-17 電子装置

Publications (2)

Publication Number Publication Date
JPWO2025013528A1 JPWO2025013528A1 (https=) 2025-01-16
JPWO2025013528A5 true JPWO2025013528A5 (https=) 2026-04-10

Family

ID=94215557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025532461A Pending JPWO2025013528A1 (https=) 2023-07-11 2024-06-17

Country Status (2)

Country Link
JP (1) JPWO2025013528A1 (https=)
WO (1) WO2025013528A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6661102B1 (en) * 2002-01-18 2003-12-09 Advance Micro Devices, Inc. Semiconductor packaging apparatus for controlling die attach fillet height to reduce die shear stress
DE102016114463B4 (de) * 2016-08-04 2019-10-17 Infineon Technologies Ag Die-befestigungsverfahren und halbleiterbauelemente, die auf der grundlage solcher verfahren hergestellt werden
US12588520B2 (en) * 2020-01-23 2026-03-24 Rohm Co., Ltd. Electronic device and method for manufacturing electronic device
JP7845824B2 (ja) * 2021-03-17 2026-04-14 ローム株式会社 半導体装置

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