JPH11261044A5 - - Google Patents

Info

Publication number
JPH11261044A5
JPH11261044A5 JP1998060042A JP6004298A JPH11261044A5 JP H11261044 A5 JPH11261044 A5 JP H11261044A5 JP 1998060042 A JP1998060042 A JP 1998060042A JP 6004298 A JP6004298 A JP 6004298A JP H11261044 A5 JPH11261044 A5 JP H11261044A5
Authority
JP
Japan
Prior art keywords
solid
state imaging
imaging element
electrode
pad electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998060042A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11261044A (ja
JP3877860B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP06004298A priority Critical patent/JP3877860B2/ja
Priority claimed from JP06004298A external-priority patent/JP3877860B2/ja
Publication of JPH11261044A publication Critical patent/JPH11261044A/ja
Publication of JPH11261044A5 publication Critical patent/JPH11261044A5/ja
Application granted granted Critical
Publication of JP3877860B2 publication Critical patent/JP3877860B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP06004298A 1998-03-11 1998-03-11 固体撮像素子付半導体装置及び該半導体装置の製造方法 Expired - Fee Related JP3877860B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP06004298A JP3877860B2 (ja) 1998-03-11 1998-03-11 固体撮像素子付半導体装置及び該半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06004298A JP3877860B2 (ja) 1998-03-11 1998-03-11 固体撮像素子付半導体装置及び該半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JPH11261044A JPH11261044A (ja) 1999-09-24
JPH11261044A5 true JPH11261044A5 (https=) 2005-01-06
JP3877860B2 JP3877860B2 (ja) 2007-02-07

Family

ID=13130635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP06004298A Expired - Fee Related JP3877860B2 (ja) 1998-03-11 1998-03-11 固体撮像素子付半導体装置及び該半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP3877860B2 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2800910B1 (fr) * 1999-11-04 2003-08-22 St Microelectronics Sa Boitier semi-conducteur optique et procede de fabrication d'un tel boitier
JP2001358997A (ja) * 2000-06-12 2001-12-26 Mitsubishi Electric Corp 半導体装置
JP4727850B2 (ja) * 2001-06-21 2011-07-20 ローム株式会社 半導体電子部品
FR2827425B1 (fr) * 2001-07-13 2004-07-02 Kingpak Tech Inc Structure empilee d'un detecteur d'image et procede pour fabriquer celle-ci
JPWO2003012863A1 (ja) 2001-07-31 2004-12-09 株式会社ルネサステクノロジ 半導体装置及びその製造方法
EP1453097A4 (en) * 2001-11-05 2008-01-23 Zycube Co Ltd TUBE-FREE IMAGE SENSOR AND METHOD FOR THE PRODUCTION THEREOF
JP4191954B2 (ja) * 2002-05-17 2008-12-03 富士フイルム株式会社 撮像素子実装構造および撮像装置
JP2004312570A (ja) * 2003-04-10 2004-11-04 Seiko Precision Inc 固体撮像装置
EP1628348A4 (en) * 2003-05-23 2007-07-18 Hamamatsu Photonics Kk PHOTO DETECTION DEVICE
KR100998041B1 (ko) 2003-12-16 2010-12-03 삼성테크윈 주식회사 디지털 카메라 모듈
TWI296154B (en) 2004-01-27 2008-04-21 Casio Computer Co Ltd Optical sensor module
JP4170968B2 (ja) 2004-02-02 2008-10-22 松下電器産業株式会社 光学デバイス
JP2004207760A (ja) * 2004-04-09 2004-07-22 Matsushita Electric Ind Co Ltd 半導体装置
JP4565931B2 (ja) * 2004-08-25 2010-10-20 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP4365844B2 (ja) * 2006-09-08 2009-11-18 三菱電機株式会社 荷電粒子線の線量分布測定装置
TWI339883B (en) * 2007-02-02 2011-04-01 Unimicron Technology Corp Substrate structure for semiconductor package and manufacturing method thereof
WO2010073520A1 (ja) 2008-12-26 2010-07-01 パナソニック株式会社 固体撮像デバイスおよびその製造方法
KR101018202B1 (ko) 2009-03-30 2011-02-28 삼성전기주식회사 카메라 모듈
JP5299106B2 (ja) * 2009-06-16 2013-09-25 大日本印刷株式会社 撮像素子モジュール
JP2013122937A (ja) * 2010-03-26 2013-06-20 Panasonic Corp 光学半導体装置
JP2013084744A (ja) 2011-10-07 2013-05-09 Sony Corp 固体撮像素子および電子機器
JP5421475B2 (ja) 2012-07-04 2014-02-19 誠 雫石 撮像素子、半導体集積回路及び撮像装置
JP2024042371A (ja) * 2022-09-15 2024-03-28 ソニーセミコンダクタソリューションズ株式会社 半導体装置

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