JPWO2024147269A5 - - Google Patents

Info

Publication number
JPWO2024147269A5
JPWO2024147269A5 JP2024568715A JP2024568715A JPWO2024147269A5 JP WO2024147269 A5 JPWO2024147269 A5 JP WO2024147269A5 JP 2024568715 A JP2024568715 A JP 2024568715A JP 2024568715 A JP2024568715 A JP 2024568715A JP WO2024147269 A5 JPWO2024147269 A5 JP WO2024147269A5
Authority
JP
Japan
Prior art keywords
semiconductor device
semiconductor chip
thickness direction
pair
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024568715A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024147269A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/044791 external-priority patent/WO2024147269A1/ja
Publication of JPWO2024147269A1 publication Critical patent/JPWO2024147269A1/ja
Publication of JPWO2024147269A5 publication Critical patent/JPWO2024147269A5/ja
Pending legal-status Critical Current

Links

JP2024568715A 2023-01-06 2023-12-14 Pending JPWO2024147269A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023001097 2023-01-06
PCT/JP2023/044791 WO2024147269A1 (ja) 2023-01-06 2023-12-14 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024147269A1 JPWO2024147269A1 (https=) 2024-07-11
JPWO2024147269A5 true JPWO2024147269A5 (https=) 2025-09-16

Family

ID=91803899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024568715A Pending JPWO2024147269A1 (https=) 2023-01-06 2023-12-14

Country Status (2)

Country Link
JP (1) JPWO2024147269A1 (https=)
WO (1) WO2024147269A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9263563B2 (en) * 2013-10-31 2016-02-16 Infineon Technologies Austria Ag Semiconductor device package
EP3226293B1 (en) * 2014-11-27 2022-05-11 Mitsubishi Electric Corporation Semiconductor module and semiconductor driving device
JP6366806B1 (ja) * 2017-10-25 2018-08-01 三菱電機株式会社 電力用半導体装置

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