JPWO2024147269A1 - - Google Patents
Info
- Publication number
- JPWO2024147269A1 JPWO2024147269A1 JP2024568715A JP2024568715A JPWO2024147269A1 JP WO2024147269 A1 JPWO2024147269 A1 JP WO2024147269A1 JP 2024568715 A JP2024568715 A JP 2024568715A JP 2024568715 A JP2024568715 A JP 2024568715A JP WO2024147269 A1 JPWO2024147269 A1 JP WO2024147269A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023001097 | 2023-01-06 | ||
| PCT/JP2023/044791 WO2024147269A1 (ja) | 2023-01-06 | 2023-12-14 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024147269A1 true JPWO2024147269A1 (https=) | 2024-07-11 |
| JPWO2024147269A5 JPWO2024147269A5 (https=) | 2025-09-16 |
Family
ID=91803899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024568715A Pending JPWO2024147269A1 (https=) | 2023-01-06 | 2023-12-14 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024147269A1 (https=) |
| WO (1) | WO2024147269A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9263563B2 (en) * | 2013-10-31 | 2016-02-16 | Infineon Technologies Austria Ag | Semiconductor device package |
| CN107004673B (zh) * | 2014-11-27 | 2020-01-03 | 三菱电机株式会社 | 半导体驱动装置 |
| JP6366806B1 (ja) * | 2017-10-25 | 2018-08-01 | 三菱電機株式会社 | 電力用半導体装置 |
-
2023
- 2023-12-14 WO PCT/JP2023/044791 patent/WO2024147269A1/ja not_active Ceased
- 2023-12-14 JP JP2024568715A patent/JPWO2024147269A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024147269A1 (ja) | 2024-07-11 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250627 |