JPWO2023176370A5 - - Google Patents
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- Publication number
- JPWO2023176370A5 JPWO2023176370A5 JP2024507659A JP2024507659A JPWO2023176370A5 JP WO2023176370 A5 JPWO2023176370 A5 JP WO2023176370A5 JP 2024507659 A JP2024507659 A JP 2024507659A JP 2024507659 A JP2024507659 A JP 2024507659A JP WO2023176370 A5 JPWO2023176370 A5 JP WO2023176370A5
- Authority
- JP
- Japan
- Prior art keywords
- dimension
- semiconductor element
- die pad
- wires
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 20
- 230000003746 surface roughness Effects 0.000 claims 9
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022042701 | 2022-03-17 | ||
| PCT/JP2023/006742 WO2023176370A1 (ja) | 2022-03-17 | 2023-02-24 | 半導体素子および半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023176370A1 JPWO2023176370A1 (https=) | 2023-09-21 |
| JPWO2023176370A5 true JPWO2023176370A5 (https=) | 2024-11-21 |
Family
ID=88023448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024507659A Pending JPWO2023176370A1 (https=) | 2022-03-17 | 2023-02-24 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250006775A1 (https=) |
| JP (1) | JPWO2023176370A1 (https=) |
| WO (1) | WO2023176370A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014090117A (ja) * | 2012-10-31 | 2014-05-15 | Rohm Co Ltd | 半導体装置、半導体装置の実装構造、および半導体装置の製造方法 |
| US11233029B2 (en) * | 2013-04-10 | 2022-01-25 | Mitsubishi Electric Corporation | Semiconductor device having a device fixed on a substrate with an adhesive |
| JP6522402B2 (ja) * | 2015-04-16 | 2019-05-29 | ローム株式会社 | 半導体装置 |
| JP2017135295A (ja) * | 2016-01-29 | 2017-08-03 | サンケン電気株式会社 | 半導体素子 |
| JP2018157168A (ja) * | 2017-03-21 | 2018-10-04 | 東芝メモリ株式会社 | 半導体装置及びその製造方法 |
| WO2019163941A1 (ja) * | 2018-02-22 | 2019-08-29 | 京セラ株式会社 | パワーモジュール用基板およびパワーモジュール |
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2023
- 2023-02-24 JP JP2024507659A patent/JPWO2023176370A1/ja active Pending
- 2023-02-24 WO PCT/JP2023/006742 patent/WO2023176370A1/ja not_active Ceased
-
2024
- 2024-09-12 US US18/883,501 patent/US20250006775A1/en active Pending