JPWO2023090261A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2023090261A5 JPWO2023090261A5 JP2023561567A JP2023561567A JPWO2023090261A5 JP WO2023090261 A5 JPWO2023090261 A5 JP WO2023090261A5 JP 2023561567 A JP2023561567 A JP 2023561567A JP 2023561567 A JP2023561567 A JP 2023561567A JP WO2023090261 A5 JPWO2023090261 A5 JP WO2023090261A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealing resin
- pillar
- semiconductor device
- viewed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 28
- 229920005989 resin Polymers 0.000 claims 28
- 238000007789 sealing Methods 0.000 claims 17
- 239000004065 semiconductor Substances 0.000 claims 16
- 239000010410 layer Substances 0.000 claims 6
- 239000011241 protective layer Substances 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021188396 | 2021-11-19 | ||
| PCT/JP2022/042025 WO2023090261A1 (ja) | 2021-11-19 | 2022-11-11 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023090261A1 JPWO2023090261A1 (https=) | 2023-05-25 |
| JPWO2023090261A5 true JPWO2023090261A5 (https=) | 2024-08-02 |
Family
ID=86396931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023561567A Pending JPWO2023090261A1 (https=) | 2021-11-19 | 2022-11-11 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240297107A1 (https=) |
| JP (1) | JPWO2023090261A1 (https=) |
| CN (1) | CN118235240A (https=) |
| DE (1) | DE112022005523T5 (https=) |
| WO (1) | WO2023090261A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3313009B2 (ja) * | 1995-05-19 | 2002-08-12 | 新光電気工業株式会社 | 放熱部材、リードフレーム及び半導体装置 |
| US9117795B2 (en) * | 2012-02-09 | 2015-08-25 | Fuji Electric Co., Ltd. | Semiconductor device |
| JP6046421B2 (ja) * | 2012-08-31 | 2016-12-14 | 京セラ株式会社 | 配線基板および電子装置 |
| JP7406973B2 (ja) | 2019-12-11 | 2023-12-28 | ローム株式会社 | 半導体装置 |
| JP7416638B2 (ja) * | 2020-02-05 | 2024-01-17 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
-
2022
- 2022-11-11 CN CN202280075919.XA patent/CN118235240A/zh active Pending
- 2022-11-11 JP JP2023561567A patent/JPWO2023090261A1/ja active Pending
- 2022-11-11 WO PCT/JP2022/042025 patent/WO2023090261A1/ja not_active Ceased
- 2022-11-11 DE DE112022005523.5T patent/DE112022005523T5/de active Pending
-
2024
- 2024-05-14 US US18/663,675 patent/US20240297107A1/en active Pending