JPWO2023090261A1 - - Google Patents
Info
- Publication number
- JPWO2023090261A1 JPWO2023090261A1 JP2023561567A JP2023561567A JPWO2023090261A1 JP WO2023090261 A1 JPWO2023090261 A1 JP WO2023090261A1 JP 2023561567 A JP2023561567 A JP 2023561567A JP 2023561567 A JP2023561567 A JP 2023561567A JP WO2023090261 A1 JPWO2023090261 A1 JP WO2023090261A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/63—Vias, e.g. via plugs
- H10W70/635—Through-vias
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021188396 | 2021-11-19 | ||
| PCT/JP2022/042025 WO2023090261A1 (ja) | 2021-11-19 | 2022-11-11 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023090261A1 true JPWO2023090261A1 (https=) | 2023-05-25 |
| JPWO2023090261A5 JPWO2023090261A5 (https=) | 2024-08-02 |
Family
ID=86396931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023561567A Pending JPWO2023090261A1 (https=) | 2021-11-19 | 2022-11-11 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240297107A1 (https=) |
| JP (1) | JPWO2023090261A1 (https=) |
| CN (1) | CN118235240A (https=) |
| DE (1) | DE112022005523T5 (https=) |
| WO (1) | WO2023090261A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3313009B2 (ja) * | 1995-05-19 | 2002-08-12 | 新光電気工業株式会社 | 放熱部材、リードフレーム及び半導体装置 |
| US9117795B2 (en) * | 2012-02-09 | 2015-08-25 | Fuji Electric Co., Ltd. | Semiconductor device |
| JP6046421B2 (ja) * | 2012-08-31 | 2016-12-14 | 京セラ株式会社 | 配線基板および電子装置 |
| JP7406973B2 (ja) | 2019-12-11 | 2023-12-28 | ローム株式会社 | 半導体装置 |
| JP7416638B2 (ja) * | 2020-02-05 | 2024-01-17 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
-
2022
- 2022-11-11 CN CN202280075919.XA patent/CN118235240A/zh active Pending
- 2022-11-11 JP JP2023561567A patent/JPWO2023090261A1/ja active Pending
- 2022-11-11 WO PCT/JP2022/042025 patent/WO2023090261A1/ja not_active Ceased
- 2022-11-11 DE DE112022005523.5T patent/DE112022005523T5/de active Pending
-
2024
- 2024-05-14 US US18/663,675 patent/US20240297107A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023090261A1 (ja) | 2023-05-25 |
| CN118235240A (zh) | 2024-06-21 |
| US20240297107A1 (en) | 2024-09-05 |
| DE112022005523T5 (de) | 2024-09-12 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240426 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251104 |