JPWO2023189930A5 - - Google Patents
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- Publication number
- JPWO2023189930A5 JPWO2023189930A5 JP2024511951A JP2024511951A JPWO2023189930A5 JP WO2023189930 A5 JPWO2023189930 A5 JP WO2023189930A5 JP 2024511951 A JP2024511951 A JP 2024511951A JP 2024511951 A JP2024511951 A JP 2024511951A JP WO2023189930 A5 JPWO2023189930 A5 JP WO2023189930A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- semiconductor device
- opening
- thickness direction
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 20
- 239000002184 metal Substances 0.000 claims 9
- 239000000463 material Substances 0.000 claims 4
- 230000001681 protective effect Effects 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000009719 polyimide resin Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022058713 | 2022-03-31 | ||
| PCT/JP2023/011189 WO2023189930A1 (ja) | 2022-03-31 | 2023-03-22 | 半導体素子および半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023189930A1 JPWO2023189930A1 (https=) | 2023-10-05 |
| JPWO2023189930A5 true JPWO2023189930A5 (https=) | 2024-12-13 |
Family
ID=88201958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024511951A Pending JPWO2023189930A1 (https=) | 2022-03-31 | 2023-03-22 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250022822A1 (https=) |
| JP (1) | JPWO2023189930A1 (https=) |
| WO (1) | WO2023189930A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4979154B2 (ja) * | 2000-06-07 | 2012-07-18 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| CN105051886B (zh) * | 2013-03-25 | 2018-06-08 | 瑞萨电子株式会社 | 半导体装置及其制造方法 |
| JP6210482B2 (ja) * | 2013-04-04 | 2017-10-11 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| JP2016004877A (ja) * | 2014-06-16 | 2016-01-12 | ルネサスエレクトロニクス株式会社 | 半導体装置および電子装置 |
| JP2017033984A (ja) * | 2015-07-29 | 2017-02-09 | セイコーエプソン株式会社 | 半導体装置及びその製造方法、並びに、電子機器 |
| JP6814698B2 (ja) * | 2017-06-05 | 2021-01-20 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP7611155B2 (ja) * | 2019-09-30 | 2025-01-09 | ローム株式会社 | 半導体装置 |
-
2023
- 2023-03-22 JP JP2024511951A patent/JPWO2023189930A1/ja active Pending
- 2023-03-22 WO PCT/JP2023/011189 patent/WO2023189930A1/ja not_active Ceased
-
2024
- 2024-09-27 US US18/899,816 patent/US20250022822A1/en active Pending
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