JPWO2025018112A5 - - Google Patents

Info

Publication number
JPWO2025018112A5
JPWO2025018112A5 JP2025533935A JP2025533935A JPWO2025018112A5 JP WO2025018112 A5 JPWO2025018112 A5 JP WO2025018112A5 JP 2025533935 A JP2025533935 A JP 2025533935A JP 2025533935 A JP2025533935 A JP 2025533935A JP WO2025018112 A5 JPWO2025018112 A5 JP WO2025018112A5
Authority
JP
Japan
Prior art keywords
layer
semiconductor
semiconductor device
lead
pad portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025533935A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025018112A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/023093 external-priority patent/WO2025018112A1/ja
Publication of JPWO2025018112A1 publication Critical patent/JPWO2025018112A1/ja
Publication of JPWO2025018112A5 publication Critical patent/JPWO2025018112A5/ja
Pending legal-status Critical Current

Links

JP2025533935A 2023-07-20 2024-06-26 Pending JPWO2025018112A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023118024 2023-07-20
PCT/JP2024/023093 WO2025018112A1 (ja) 2023-07-20 2024-06-26 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2025018112A1 JPWO2025018112A1 (https=) 2025-01-23
JPWO2025018112A5 true JPWO2025018112A5 (https=) 2026-04-17

Family

ID=94281355

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025533935A Pending JPWO2025018112A1 (https=) 2023-07-20 2024-06-26

Country Status (2)

Country Link
JP (1) JPWO2025018112A1 (https=)
WO (1) WO2025018112A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103493190A (zh) * 2011-12-27 2014-01-01 松下电器产业株式会社 接合结构体
JP2017103434A (ja) * 2015-12-04 2017-06-08 トヨタ自動車株式会社 半導体装置
JP6355092B1 (ja) * 2017-05-11 2018-07-11 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた接合構造体

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