JPWO2023095681A5 - - Google Patents
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- Publication number
- JPWO2023095681A5 JPWO2023095681A5 JP2023563637A JP2023563637A JPWO2023095681A5 JP WO2023095681 A5 JPWO2023095681 A5 JP WO2023095681A5 JP 2023563637 A JP2023563637 A JP 2023563637A JP 2023563637 A JP2023563637 A JP 2023563637A JP WO2023095681 A5 JPWO2023095681 A5 JP WO2023095681A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- semiconductor device
- lead
- thickness direction
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 22
- 239000002184 metal Substances 0.000 claims 13
- 239000000463 material Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021190267 | 2021-11-24 | ||
| PCT/JP2022/042404 WO2023095681A1 (ja) | 2021-11-24 | 2022-11-15 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023095681A1 JPWO2023095681A1 (https=) | 2023-06-01 |
| JPWO2023095681A5 true JPWO2023095681A5 (https=) | 2024-08-06 |
Family
ID=86539660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023563637A Pending JPWO2023095681A1 (https=) | 2021-11-24 | 2022-11-15 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240290693A1 (https=) |
| JP (1) | JPWO2023095681A1 (https=) |
| CN (1) | CN118382917A (https=) |
| DE (1) | DE112022005582T5 (https=) |
| WO (1) | WO2023095681A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3773679B2 (ja) * | 1998-11-20 | 2006-05-10 | 富士通株式会社 | テープキャリアパッケージ |
| JP4549491B2 (ja) * | 2000-03-13 | 2010-09-22 | 大日本印刷株式会社 | 樹脂封止型半導体装置 |
| JP2010258200A (ja) * | 2009-04-24 | 2010-11-11 | Panasonic Corp | 半導体装置およびその製造方法 |
| JP7199921B2 (ja) * | 2018-11-07 | 2023-01-06 | ローム株式会社 | 半導体装置 |
| JP7339000B2 (ja) * | 2019-03-18 | 2023-09-05 | ローム株式会社 | 半導体装置および半導体パッケージ |
-
2022
- 2022-11-15 CN CN202280077902.8A patent/CN118382917A/zh active Pending
- 2022-11-15 DE DE112022005582.0T patent/DE112022005582T5/de active Pending
- 2022-11-15 WO PCT/JP2022/042404 patent/WO2023095681A1/ja not_active Ceased
- 2022-11-15 JP JP2023563637A patent/JPWO2023095681A1/ja active Pending
-
2024
- 2024-05-09 US US18/659,791 patent/US20240290693A1/en active Pending