JPWO2022259824A5 - - Google Patents
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- JPWO2022259824A5 JPWO2022259824A5 JP2023527587A JP2023527587A JPWO2022259824A5 JP WO2022259824 A5 JPWO2022259824 A5 JP WO2022259824A5 JP 2023527587 A JP2023527587 A JP 2023527587A JP 2023527587 A JP2023527587 A JP 2023527587A JP WO2022259824 A5 JPWO2022259824 A5 JP WO2022259824A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- terminal
- thickness direction
- semiconductor element
- structure according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021095654 | 2021-06-08 | ||
| PCT/JP2022/020467 WO2022259824A1 (ja) | 2021-06-08 | 2022-05-17 | 接合構造および半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022259824A1 JPWO2022259824A1 (https=) | 2022-12-15 |
| JPWO2022259824A5 true JPWO2022259824A5 (https=) | 2025-04-18 |
Family
ID=84424850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023527587A Pending JPWO2022259824A1 (https=) | 2021-06-08 | 2022-05-17 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240047312A1 (https=) |
| JP (1) | JPWO2022259824A1 (https=) |
| CN (1) | CN117425962A (https=) |
| DE (1) | DE112022002286B4 (https=) |
| WO (1) | WO2022259824A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025173493A1 (ja) * | 2024-02-15 | 2025-08-21 | ローム株式会社 | 半導体装置、および半導体装置アッセンブリ |
| WO2025177781A1 (ja) * | 2024-02-20 | 2025-08-28 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| DE112024002197T5 (de) | 2024-03-15 | 2026-04-30 | Fuji Electric Co., Ltd. | Leistungshalbleitervorrichtung und verfahren für dessen herstellung |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4634498B2 (ja) | 2008-11-28 | 2011-02-16 | 三菱電機株式会社 | 電力用半導体モジュール |
| JP5445344B2 (ja) * | 2010-06-15 | 2014-03-19 | 三菱電機株式会社 | 電力用半導体装置 |
| JP6481527B2 (ja) * | 2015-06-25 | 2019-03-13 | 富士電機株式会社 | 半導体装置 |
| US11127662B2 (en) * | 2017-03-14 | 2021-09-21 | Rohm Co., Ltd. | Semiconductor device |
| JP6866716B2 (ja) | 2017-03-23 | 2021-04-28 | 富士電機株式会社 | 半導体装置 |
-
2022
- 2022-05-17 WO PCT/JP2022/020467 patent/WO2022259824A1/ja not_active Ceased
- 2022-05-17 DE DE112022002286.8T patent/DE112022002286B4/de active Active
- 2022-05-17 CN CN202280040247.9A patent/CN117425962A/zh active Pending
- 2022-05-17 JP JP2023527587A patent/JPWO2022259824A1/ja active Pending
-
2023
- 2023-10-17 US US18/488,503 patent/US20240047312A1/en active Pending
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