DE112022002286B4 - Verbindungsstruktur und halbleiterbauteil - Google Patents

Verbindungsstruktur und halbleiterbauteil

Info

Publication number
DE112022002286B4
DE112022002286B4 DE112022002286.8T DE112022002286T DE112022002286B4 DE 112022002286 B4 DE112022002286 B4 DE 112022002286B4 DE 112022002286 T DE112022002286 T DE 112022002286T DE 112022002286 B4 DE112022002286 B4 DE 112022002286B4
Authority
DE
Germany
Prior art keywords
conductive
terminal
thickness direction
holder
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE112022002286.8T
Other languages
German (de)
English (en)
Other versions
DE112022002286T5 (de
Inventor
Kohei Tanikawa
Oji SATO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE112022002286T5 publication Critical patent/DE112022002286T5/de
Application granted granted Critical
Publication of DE112022002286B4 publication Critical patent/DE112022002286B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Inverter Devices (AREA)
DE112022002286.8T 2021-06-08 2022-05-17 Verbindungsstruktur und halbleiterbauteil Active DE112022002286B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-095654 2021-06-08
JP2021095654 2021-06-08
PCT/JP2022/020467 WO2022259824A1 (ja) 2021-06-08 2022-05-17 接合構造および半導体装置

Publications (2)

Publication Number Publication Date
DE112022002286T5 DE112022002286T5 (de) 2024-02-22
DE112022002286B4 true DE112022002286B4 (de) 2025-10-02

Family

ID=84424850

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022002286.8T Active DE112022002286B4 (de) 2021-06-08 2022-05-17 Verbindungsstruktur und halbleiterbauteil

Country Status (5)

Country Link
US (1) US20240047312A1 (https=)
JP (1) JPWO2022259824A1 (https=)
CN (1) CN117425962A (https=)
DE (1) DE112022002286B4 (https=)
WO (1) WO2022259824A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025173493A1 (ja) * 2024-02-15 2025-08-21 ローム株式会社 半導体装置、および半導体装置アッセンブリ
WO2025177781A1 (ja) * 2024-02-20 2025-08-28 ローム株式会社 半導体装置および半導体装置の製造方法
DE112024002197T5 (de) 2024-03-15 2026-04-30 Fuji Electric Co., Ltd. Leistungshalbleitervorrichtung und verfahren für dessen herstellung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010129795A (ja) 2008-11-28 2010-06-10 Mitsubishi Electric Corp 電力用半導体モジュール
US20160380366A1 (en) 2015-06-25 2016-12-29 Fuji Electric Co., Ltd. Semiconductor device
DE102018200830A1 (de) 2017-03-23 2018-09-27 Fuji Electric Co., Ltd. Halbleitervorrichtung
DE112018001927T5 (de) 2017-03-14 2019-12-19 Rohm Co., Ltd. Halbleiterbauelement

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5445344B2 (ja) * 2010-06-15 2014-03-19 三菱電機株式会社 電力用半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010129795A (ja) 2008-11-28 2010-06-10 Mitsubishi Electric Corp 電力用半導体モジュール
US20160380366A1 (en) 2015-06-25 2016-12-29 Fuji Electric Co., Ltd. Semiconductor device
DE112018001927T5 (de) 2017-03-14 2019-12-19 Rohm Co., Ltd. Halbleiterbauelement
DE102018200830A1 (de) 2017-03-23 2018-09-27 Fuji Electric Co., Ltd. Halbleitervorrichtung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP 2012 - 4 226 A_(Maschinenübersetzung, DPMA, Übersetzung erstellt am 23.12.2023).pdf

Also Published As

Publication number Publication date
US20240047312A1 (en) 2024-02-08
DE112022002286T5 (de) 2024-02-22
JPWO2022259824A1 (https=) 2022-12-15
WO2022259824A1 (ja) 2022-12-15
CN117425962A (zh) 2024-01-19

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R016 Response to examination communication
R018 Grant decision by examination section/examining division
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023488000

Ipc: H10W0072000000