JPWO2022259824A1 - - Google Patents
Info
- Publication number
- JPWO2022259824A1 JPWO2022259824A1 JP2023527587A JP2023527587A JPWO2022259824A1 JP WO2022259824 A1 JPWO2022259824 A1 JP WO2022259824A1 JP 2023527587 A JP2023527587 A JP 2023527587A JP 2023527587 A JP2023527587 A JP 2023527587A JP WO2022259824 A1 JPWO2022259824 A1 JP WO2022259824A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/464—Additional interconnections in combination with leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/811—Multiple chips on leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/926—Multiple bond pads having different sizes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
- H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021095654 | 2021-06-08 | ||
| PCT/JP2022/020467 WO2022259824A1 (ja) | 2021-06-08 | 2022-05-17 | 接合構造および半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022259824A1 true JPWO2022259824A1 (https=) | 2022-12-15 |
| JPWO2022259824A5 JPWO2022259824A5 (https=) | 2025-04-18 |
Family
ID=84424850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023527587A Pending JPWO2022259824A1 (https=) | 2021-06-08 | 2022-05-17 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240047312A1 (https=) |
| JP (1) | JPWO2022259824A1 (https=) |
| CN (1) | CN117425962A (https=) |
| DE (1) | DE112022002286B4 (https=) |
| WO (1) | WO2022259824A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025173493A1 (ja) * | 2024-02-15 | 2025-08-21 | ローム株式会社 | 半導体装置、および半導体装置アッセンブリ |
| WO2025177781A1 (ja) * | 2024-02-20 | 2025-08-28 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| DE112024002197T5 (de) | 2024-03-15 | 2026-04-30 | Fuji Electric Co., Ltd. | Leistungshalbleitervorrichtung und verfahren für dessen herstellung |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012004226A (ja) * | 2010-06-15 | 2012-01-05 | Mitsubishi Electric Corp | 電力用半導体装置 |
| JP2017011221A (ja) * | 2015-06-25 | 2017-01-12 | 富士電機株式会社 | 半導体装置 |
| WO2018168924A1 (ja) * | 2017-03-14 | 2018-09-20 | ローム株式会社 | 半導体装置 |
| JP2018160554A (ja) * | 2017-03-23 | 2018-10-11 | 富士電機株式会社 | 半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4634498B2 (ja) | 2008-11-28 | 2011-02-16 | 三菱電機株式会社 | 電力用半導体モジュール |
-
2022
- 2022-05-17 WO PCT/JP2022/020467 patent/WO2022259824A1/ja not_active Ceased
- 2022-05-17 DE DE112022002286.8T patent/DE112022002286B4/de active Active
- 2022-05-17 CN CN202280040247.9A patent/CN117425962A/zh active Pending
- 2022-05-17 JP JP2023527587A patent/JPWO2022259824A1/ja active Pending
-
2023
- 2023-10-17 US US18/488,503 patent/US20240047312A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012004226A (ja) * | 2010-06-15 | 2012-01-05 | Mitsubishi Electric Corp | 電力用半導体装置 |
| JP2017011221A (ja) * | 2015-06-25 | 2017-01-12 | 富士電機株式会社 | 半導体装置 |
| WO2018168924A1 (ja) * | 2017-03-14 | 2018-09-20 | ローム株式会社 | 半導体装置 |
| JP2018160554A (ja) * | 2017-03-23 | 2018-10-11 | 富士電機株式会社 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20240047312A1 (en) | 2024-02-08 |
| DE112022002286T5 (de) | 2024-02-22 |
| WO2022259824A1 (ja) | 2022-12-15 |
| DE112022002286B4 (de) | 2025-10-02 |
| CN117425962A (zh) | 2024-01-19 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
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