JPWO2024024378A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2024024378A5
JPWO2024024378A5 JP2024536876A JP2024536876A JPWO2024024378A5 JP WO2024024378 A5 JPWO2024024378 A5 JP WO2024024378A5 JP 2024536876 A JP2024536876 A JP 2024536876A JP 2024536876 A JP2024536876 A JP 2024536876A JP WO2024024378 A5 JPWO2024024378 A5 JP WO2024024378A5
Authority
JP
Japan
Prior art keywords
semiconductor device
protrusions
holder
thickness direction
circumferential surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024536876A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024024378A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/023922 external-priority patent/WO2024024378A1/ja
Publication of JPWO2024024378A1 publication Critical patent/JPWO2024024378A1/ja
Publication of JPWO2024024378A5 publication Critical patent/JPWO2024024378A5/ja
Pending legal-status Critical Current

Links

JP2024536876A 2022-07-26 2023-06-28 Pending JPWO2024024378A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022118714 2022-07-26
PCT/JP2023/023922 WO2024024378A1 (ja) 2022-07-26 2023-06-28 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024024378A1 JPWO2024024378A1 (https=) 2024-02-01
JPWO2024024378A5 true JPWO2024024378A5 (https=) 2025-04-03

Family

ID=89706064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024536876A Pending JPWO2024024378A1 (https=) 2022-07-26 2023-06-28

Country Status (2)

Country Link
JP (1) JPWO2024024378A1 (https=)
WO (1) WO2024024378A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008005547B4 (de) * 2008-01-23 2013-08-29 Infineon Technologies Ag Leistungshalbleitermodul und Schaltungsanordnung mit einem Leistungshalbleitermodul
JP5101467B2 (ja) * 2008-11-26 2012-12-19 三菱電機株式会社 電力用半導体モジュール
JP6004001B2 (ja) * 2012-10-29 2016-10-05 富士電機株式会社 半導体装置
JP7468149B2 (ja) * 2020-05-27 2024-04-16 富士電機株式会社 半導体装置

Similar Documents

Publication Publication Date Title
JP5637156B2 (ja) 半導体モジュール
US11765979B2 (en) Vibration device
JP2006114883A (ja) パワー半導体モジュール及びディスクセル用のコンタクト装置
JPWO2023214500A5 (https=)
JP2018113301A (ja) 半導体装置とその製造方法
JPWO2022259824A5 (https=)
JPH01292999A (ja) 圧電膜式電気音響インサート
JPWO2024024378A5 (https=)
US11441553B2 (en) Piezoelectric driving device
JPWO2022264834A5 (https=)
JPH08241956A (ja) 半導体素子の圧力接触ハウジング
JP2022181817A5 (https=)
JP7351407B2 (ja) アクチュエータ、流体制御装置、および、アクチュエータの製造方法
WO2020090379A1 (ja) 基板状構造体及びヒータシステム
JPH0745964Y2 (ja) リードレス型電子部品
JPWO2021186860A5 (https=)
JPWO2023199808A5 (https=)
JP2019087582A (ja) サーミスタ素子
JPS5814562Y2 (ja) バリスタ
JPH0110881Y2 (https=)
KR840002856Y1 (ko) 세라믹 트리머 콘덴서
JPH0328518Y2 (https=)
JP2004119931A (ja) 可変コンデンサ
JPH02220452A (ja) 半導体装置
JPWO2022259825A5 (https=)