JPWO2024024378A1 - - Google Patents
Info
- Publication number
- JPWO2024024378A1 JPWO2024024378A1 JP2024536876A JP2024536876A JPWO2024024378A1 JP WO2024024378 A1 JPWO2024024378 A1 JP WO2024024378A1 JP 2024536876 A JP2024536876 A JP 2024536876A JP 2024536876 A JP2024536876 A JP 2024536876A JP WO2024024378 A1 JPWO2024024378 A1 JP WO2024024378A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
- H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022118714 | 2022-07-26 | ||
| PCT/JP2023/023922 WO2024024378A1 (ja) | 2022-07-26 | 2023-06-28 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024024378A1 true JPWO2024024378A1 (https=) | 2024-02-01 |
| JPWO2024024378A5 JPWO2024024378A5 (https=) | 2025-04-03 |
Family
ID=89706064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024536876A Pending JPWO2024024378A1 (https=) | 2022-07-26 | 2023-06-28 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024024378A1 (https=) |
| WO (1) | WO2024024378A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008005547B4 (de) * | 2008-01-23 | 2013-08-29 | Infineon Technologies Ag | Leistungshalbleitermodul und Schaltungsanordnung mit einem Leistungshalbleitermodul |
| JP5101467B2 (ja) * | 2008-11-26 | 2012-12-19 | 三菱電機株式会社 | 電力用半導体モジュール |
| JP6004001B2 (ja) * | 2012-10-29 | 2016-10-05 | 富士電機株式会社 | 半導体装置 |
| JP7468149B2 (ja) * | 2020-05-27 | 2024-04-16 | 富士電機株式会社 | 半導体装置 |
-
2023
- 2023-06-28 WO PCT/JP2023/023922 patent/WO2024024378A1/ja not_active Ceased
- 2023-06-28 JP JP2024536876A patent/JPWO2024024378A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024024378A1 (ja) | 2024-02-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241223 |