JP7468149B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP7468149B2 JP7468149B2 JP2020092407A JP2020092407A JP7468149B2 JP 7468149 B2 JP7468149 B2 JP 7468149B2 JP 2020092407 A JP2020092407 A JP 2020092407A JP 2020092407 A JP2020092407 A JP 2020092407A JP 7468149 B2 JP7468149 B2 JP 7468149B2
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- external connection
- semiconductor device
- connection terminal
- pull
- hole
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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Description
第1の実施の形態の半導体装置1について図1及び図2を用いて説明する。図1は、第1の実施の形態の半導体装置の断面図であり、図2は、第1の実施の形態の半導体装置に含まれる絶縁回路基板の平面図である。なお、図2は、図1の半導体装置1からケース40を取り外した場合の平面図を表している。また、本実施の形態では、複数の回路パターン12、第1,第2半導体チップ20,21、複数のコンタクト部品30、複数のボンディングワイヤ15、複数の外部接続端子50に対して、それぞれ区別することなく、同じ符号を付して説明する。なお、これら以外の構成についても、複数あるものはそれぞれ区別することなく、同じ符号を付して同じ符号で説明する。
第2の実施の形態では、第1の実施の形態とは異なるコンタクト部品30及び外部接続端子50が用いられる。但し、第2の実施の形態でも、第1の実施の形態の半導体装置1が用いられる。以下では、第2の実施の形態のコンタクト部品30及び外部接続端子50について図10~図12を用いて説明する。図10は、第2の実施の形態の半導体装置に含まれるコンタクト部品を説明するための図である。図11は、第2の実施の形態の半導体装置に含まれる外部接続端子の正面図であり、図12は、第2の実施の形態の半導体装置に含まれる外部接続端子の平面断面図である。なお、図12(A)及び図12(B)は、いずれも、図11の一点鎖線X-Xにおける断面図である。図12(B)は、図12(A)とは別の断面図である。
第3の実施の形態のコンタクト部品30及び外部接続端子50について図18及び図19を用いて説明する。図18は、第3の実施の形態の半導体装置に含まれるコンタクト部品を説明するための図であり、図19は、第3の実施の形態の半導体装置に含まれる外部接続端子を説明するための図である。なお、図19(A)は、外部接続端子50の正面図、図19(B)は、図19(A)の一点鎖線X-Xにおける平面断面図である。
10 絶縁回路基板
11 絶縁板
12 回路パターン
13 金属板
15 ボンディングワイヤ
20 第1半導体チップ
21 第2半導体チップ
23 電子部品
30 コンタクト部品
31 本体部
31a 内周面
31b 外周面
31c 貫通孔
31c1,31c2 開口端部
31d 上部凸部
31d1 上部挿入係止面
31d2 支持面
31d3 引き抜き係止面
31e 下部凸部
31e1 下部挿入係止面
32,33 フランジ
34 引き抜き係止部
35 挿入係止部
40 ケース
41 外囲部
41a 接着剤
42 上蓋部
42a 挿通孔
43 封止部材
50 外部接続端子
51 胴体部
51a,51e 角部
51b 外面部
51c 肉厚部
51c3,51d3 引き抜き被係止面
51d 凹部
51d1 挿入被係止面
51d2 被支持面
51f 先頭部
52,53 先端部
52a,53a テーパ面
Claims (19)
- 回路パターンと、円筒状の貫通孔が形成され、前記回路パターンに一方の開口端部が接合されたコンタクト部品と、角柱状の胴体部を備え、前記胴体部の先端部側が前記貫通孔に挿入された外部接続端子と、を有し、
前記外部接続端子は、挿入被係止部が前記胴体部の先端部に形成され、
前記コンタクト部品は、挿入係止部が前記貫通孔の内周面に形成され、
前記挿入係止部は、前記貫通孔に挿入された前記外部接続端子の前記挿入被係止部に対して挿入方向側に形成されて、
前記外部接続端子は、引き抜き被係止部が前記胴体部の外面部に形成され、
前記コンタクト部品は、引き抜き係止部が前記貫通孔の内周面に形成され、
前記引き抜き被係止部は、前記挿入被係止部から前記挿入方向の反対側に離間しており、
前記引き抜き係止部は、前記引き抜き被係止部より前記挿入方向の反対側に形成されている、
半導体装置。 - 前記挿入被係止部は、前記先端部において前記回路パターンに近づくにつれて縮径する側面を成すテーパ面である、
請求項1に記載の半導体装置。 - 前記挿入係止部は、前記コンタクト部品の前記貫通孔の内周面から前記貫通孔の中心に向かって突出しており、
前記引き抜き係止部は、前記コンタクト部品の前記貫通孔の内周面から前記貫通孔の中心に向かって突出しており、
前記挿入係止部の内径は、前記引き抜き係止部の内径よりも短くまたは同一である、
請求項1または2に記載の半導体装置。 - 前記引き抜き被係止部は、前記外部接続端子の胴体部から外側に突出し、前記胴体部に前記先端部から前記挿入方向の反対側に離間して形成された肉厚部であり、
前記胴体部の中心部を挟んで対向する前記肉厚部の角部間の長さは、前記胴体部の対角の長さよりも長い、
請求項1乃至3のいずれかに記載の半導体装置。 - 前記外部接続端子は、平面視で、前記外面部の中央部がそれぞれ窪むと共に、前記肉厚部が前記胴体部の角部から外側に突出してそれぞれ設けられている、
請求項4に記載の半導体装置。 - 前記外部接続端子は、平面視で、前記胴体部の一対の対向する前記外面部に前記肉厚部がそれぞれ設けられている、
請求項4に記載の半導体装置。 - 前記外部接続端子は、平面視で、前記肉厚部が前記胴体部の一対の対向する角部から外側に突出してそれぞれ設けられている、
請求項4に記載の半導体装置。 - 前記胴体部の中心部を挟んで対向する前記肉厚部の角部間の長さは、前記コンタクト部品の前記貫通孔の内径よりも長くまたは同一であって、
前記コンタクト部品の前記貫通孔の内径は、前記引き抜き係止部の内径よりも長く、
前記引き抜き係止部の内径は、前記胴体部の対角線の長さよりも長く、または、同一である、
請求項4に記載の半導体装置。 - 前記コンタクト部品の前記貫通孔の内径は、前記胴体部の中心部を挟んで対向する前記肉厚部の角部間の長さよりも長く、
前記胴体部の前記肉厚部の角部間の長さは、前記引き抜き係止部の内径よりも長く、
前記引き抜き係止部の内径は、前記胴体部の対角線の長さよりも長く、または、同一である、
請求項4に記載の半導体装置。 - 前記挿入係止部は、前記コンタクト部品の前記貫通孔の内周面に前記挿入方向に対して反対方向に傾斜して形成され、前記テーパ面に対向する面を備える、
請求項2に記載の半導体装置。 - 前記引き抜き被係止部は、前記胴体部に前記先端部から前記挿入方向の反対側に前記外面部の周方向に沿って形成された凹部である、
請求項1または2に記載の半導体装置。 - 前記引き抜き係止部は、前記コンタクト部品の前記貫通孔の内周面から突出して、前記凹部に嵌合する凸部である、
請求項11に記載の半導体装置。 - 前記引き抜き被係止部は、前記外部接続端子の前記凹部において前記挿入方向に対して反対方向に傾斜する引き抜き被係止面を備える、
請求項12に記載の半導体装置。 - 前記引き抜き係止部の前記凸部は、前記凸部の挿入方向側に、前記挿入方向に向かって傾斜して形成される引き抜き係止面を備える、
請求項13に記載の半導体装置。 - 前記外部接続端子は、平面視で、前記胴体部の前記凹部の外側に面する角部が面取りされている、
請求項14に記載の半導体装置。 - 前記外部接続端子の前記胴体部の対角線の長さは、前記コンタクト部品の前記貫通孔の内径よりも長く、または、同一である、
請求項15に記載の半導体装置。 - 前記コンタクト部品の前記貫通孔の内径は、前記引き抜き係止部の内径よりも長く、
前記引き抜き係止部の内径は、前記胴体部の前記凹部の最長対角線の長さよりも長く、または、同一である、
請求項16に記載の半導体装置。 - 前記外部接続端子の前記凹部は、前記胴体部に前記引き抜き被係止面から前記挿入方向の反対側に離間して、前記挿入方向に傾斜する別の挿入被係止面を備える、
請求項16または17に記載の半導体装置。 - 前記コンタクト部品の前記引き抜き係止部は、前記貫通孔の内周面に前記挿入方向に対して反対方向に傾斜して形成され、前記別の挿入被係止面に対向する別の挿入係止面を含む、
請求項18に記載の半導体装置。
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JP2013125803A (ja) | 2011-12-14 | 2013-06-24 | Fuji Electric Co Ltd | 半導体装置及び半導体装置の製造方法 |
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