JPWO2023243464A5 - - Google Patents

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Publication number
JPWO2023243464A5
JPWO2023243464A5 JP2024528727A JP2024528727A JPWO2023243464A5 JP WO2023243464 A5 JPWO2023243464 A5 JP WO2023243464A5 JP 2024528727 A JP2024528727 A JP 2024528727A JP 2024528727 A JP2024528727 A JP 2024528727A JP WO2023243464 A5 JPWO2023243464 A5 JP WO2023243464A5
Authority
JP
Japan
Prior art keywords
semiconductor
module according
semiconductor module
semiconductor devices
thickness direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024528727A
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English (en)
Japanese (ja)
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JPWO2023243464A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/020834 external-priority patent/WO2023243464A1/ja
Publication of JPWO2023243464A1 publication Critical patent/JPWO2023243464A1/ja
Publication of JPWO2023243464A5 publication Critical patent/JPWO2023243464A5/ja
Pending legal-status Critical Current

Links

JP2024528727A 2022-06-17 2023-06-05 Pending JPWO2023243464A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022097847 2022-06-17
JP2022114115 2022-07-15
PCT/JP2023/020834 WO2023243464A1 (ja) 2022-06-17 2023-06-05 半導体装置、半導体モジュール、および半導体モジュールの取付構造

Publications (2)

Publication Number Publication Date
JPWO2023243464A1 JPWO2023243464A1 (https=) 2023-12-21
JPWO2023243464A5 true JPWO2023243464A5 (https=) 2025-02-26

Family

ID=89191139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024528727A Pending JPWO2023243464A1 (https=) 2022-06-17 2023-06-05

Country Status (2)

Country Link
JP (1) JPWO2023243464A1 (https=)
WO (1) WO2023243464A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025177840A1 (ja) * 2024-02-22 2025-08-28 ローム株式会社 半導体装置および車両

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5464159B2 (ja) * 2011-03-08 2014-04-09 三菱電機株式会社 パワーモジュール
JP5975177B2 (ja) * 2013-07-16 2016-08-23 三菱電機株式会社 半導体装置
CN113302736B (zh) * 2019-01-21 2024-01-02 罗姆股份有限公司 半导体模块和ac/dc转换器组件
JP7530364B2 (ja) * 2019-08-21 2024-08-07 ローム株式会社 制御モジュールおよび半導体装置

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