JPWO2023243464A1 - - Google Patents
Info
- Publication number
- JPWO2023243464A1 JPWO2023243464A1 JP2024528727A JP2024528727A JPWO2023243464A1 JP WO2023243464 A1 JPWO2023243464 A1 JP WO2023243464A1 JP 2024528727 A JP2024528727 A JP 2024528727A JP 2024528727 A JP2024528727 A JP 2024528727A JP WO2023243464 A1 JPWO2023243464 A1 JP WO2023243464A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022097847 | 2022-06-17 | ||
| JP2022114115 | 2022-07-15 | ||
| PCT/JP2023/020834 WO2023243464A1 (ja) | 2022-06-17 | 2023-06-05 | 半導体装置、半導体モジュール、および半導体モジュールの取付構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023243464A1 true JPWO2023243464A1 (https=) | 2023-12-21 |
| JPWO2023243464A5 JPWO2023243464A5 (https=) | 2025-02-26 |
Family
ID=89191139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024528727A Pending JPWO2023243464A1 (https=) | 2022-06-17 | 2023-06-05 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023243464A1 (https=) |
| WO (1) | WO2023243464A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025177840A1 (ja) * | 2024-02-22 | 2025-08-28 | ローム株式会社 | 半導体装置および車両 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5464159B2 (ja) * | 2011-03-08 | 2014-04-09 | 三菱電機株式会社 | パワーモジュール |
| JP5975177B2 (ja) * | 2013-07-16 | 2016-08-23 | 三菱電機株式会社 | 半導体装置 |
| CN113302736B (zh) * | 2019-01-21 | 2024-01-02 | 罗姆股份有限公司 | 半导体模块和ac/dc转换器组件 |
| JP7530364B2 (ja) * | 2019-08-21 | 2024-08-07 | ローム株式会社 | 制御モジュールおよび半導体装置 |
-
2023
- 2023-06-05 JP JP2024528727A patent/JPWO2023243464A1/ja active Pending
- 2023-06-05 WO PCT/JP2023/020834 patent/WO2023243464A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023243464A1 (ja) | 2023-12-21 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241119 |