JPWO2024014362A5 - - Google Patents

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Publication number
JPWO2024014362A5
JPWO2024014362A5 JP2024533663A JP2024533663A JPWO2024014362A5 JP WO2024014362 A5 JPWO2024014362 A5 JP WO2024014362A5 JP 2024533663 A JP2024533663 A JP 2024533663A JP 2024533663 A JP2024533663 A JP 2024533663A JP WO2024014362 A5 JPWO2024014362 A5 JP WO2024014362A5
Authority
JP
Japan
Prior art keywords
film
electrode
resistive film
semiconductor device
gate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024533663A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024014362A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/024812 external-priority patent/WO2024014362A1/ja
Publication of JPWO2024014362A1 publication Critical patent/JPWO2024014362A1/ja
Publication of JPWO2024014362A5 publication Critical patent/JPWO2024014362A5/ja
Pending legal-status Critical Current

Links

JP2024533663A 2022-07-11 2023-07-04 Pending JPWO2024014362A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022111395 2022-07-11
PCT/JP2023/024812 WO2024014362A1 (ja) 2022-07-11 2023-07-04 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024014362A1 JPWO2024014362A1 (https=) 2024-01-18
JPWO2024014362A5 true JPWO2024014362A5 (https=) 2025-03-25

Family

ID=89536624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024533663A Pending JPWO2024014362A1 (https=) 2022-07-11 2023-07-04

Country Status (4)

Country Link
US (1) US20250149441A1 (https=)
JP (1) JPWO2024014362A1 (https=)
CN (1) CN119563385A (https=)
WO (1) WO2024014362A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102024201886A1 (de) 2024-02-29 2025-09-04 Infineon Technologies Ag Halbleitervorrichtung, umfassend eine lastelektroden-verbindungsleitung
DE102024209378A1 (de) * 2024-09-27 2026-04-02 Infineon Technologies Ag Halbleiterchip und verfahren zum herstellen desselben

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014150275A (ja) * 2014-04-04 2014-08-21 Mitsubishi Electric Corp 半導体装置
DE112015004374B4 (de) * 2014-09-26 2019-02-14 Mitsubishi Electric Corporation Halbleitervorrichtung
JP6929804B2 (ja) * 2017-09-20 2021-09-01 株式会社東芝 半導体装置
JP7172317B2 (ja) * 2018-09-11 2022-11-16 富士電機株式会社 半導体装置

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