JPWO2023054419A5 - - Google Patents
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- Publication number
- JPWO2023054419A5 JPWO2023054419A5 JP2023551565A JP2023551565A JPWO2023054419A5 JP WO2023054419 A5 JPWO2023054419 A5 JP WO2023054419A5 JP 2023551565 A JP2023551565 A JP 2023551565A JP 2023551565 A JP2023551565 A JP 2023551565A JP WO2023054419 A5 JPWO2023054419 A5 JP WO2023054419A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- recess
- semiconductor element
- element mounting
- cutout portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021161493 | 2021-09-30 | ||
| JP2021161493 | 2021-09-30 | ||
| PCT/JP2022/036055 WO2023054419A1 (ja) | 2021-09-30 | 2022-09-28 | 半導体素子実装用基板及び半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023054419A1 JPWO2023054419A1 (https=) | 2023-04-06 |
| JPWO2023054419A5 true JPWO2023054419A5 (https=) | 2024-06-18 |
| JP7617296B2 JP7617296B2 (ja) | 2025-01-17 |
Family
ID=85782821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023551565A Active JP7617296B2 (ja) | 2021-09-30 | 2022-09-28 | 半導体素子実装用基板及び半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240413027A1 (https=) |
| EP (1) | EP4411804A4 (https=) |
| JP (1) | JP7617296B2 (https=) |
| CN (1) | CN118043959A (https=) |
| WO (1) | WO2023054419A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240027493A1 (en) * | 2020-11-27 | 2024-01-25 | Kyocera Corporation | Wiring board and probe card |
| WO2025225641A1 (ja) * | 2024-04-25 | 2025-10-30 | 京セラ株式会社 | 配線基板、パッケージ及び光モジュール |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003243556A (ja) | 2002-02-19 | 2003-08-29 | Murata Mfg Co Ltd | 積層型基板装置 |
| JP6224322B2 (ja) * | 2013-01-30 | 2017-11-01 | 京セラ株式会社 | 電子部品収納用パッケージおよびそれを用いた電子装置 |
| JP6853252B2 (ja) | 2016-07-28 | 2021-03-31 | 京セラ株式会社 | 半導体素子実装用基板および半導体装置 |
| JP7237609B2 (ja) * | 2019-01-28 | 2023-03-13 | 京セラ株式会社 | 電子部品用パッケージおよび電子装置 |
-
2022
- 2022-09-28 CN CN202280065750.XA patent/CN118043959A/zh not_active Withdrawn
- 2022-09-28 JP JP2023551565A patent/JP7617296B2/ja active Active
- 2022-09-28 EP EP22876285.2A patent/EP4411804A4/en not_active Withdrawn
- 2022-09-28 US US18/697,104 patent/US20240413027A1/en not_active Abandoned
- 2022-09-28 WO PCT/JP2022/036055 patent/WO2023054419A1/ja not_active Ceased
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