JPWO2023054419A1 - - Google Patents

Info

Publication number
JPWO2023054419A1
JPWO2023054419A1 JP2023551565A JP2023551565A JPWO2023054419A1 JP WO2023054419 A1 JPWO2023054419 A1 JP WO2023054419A1 JP 2023551565 A JP2023551565 A JP 2023551565A JP 2023551565 A JP2023551565 A JP 2023551565A JP WO2023054419 A1 JPWO2023054419 A1 JP WO2023054419A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023551565A
Other languages
Japanese (ja)
Other versions
JPWO2023054419A5 (https=
JP7617296B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023054419A1 publication Critical patent/JPWO2023054419A1/ja
Publication of JPWO2023054419A5 publication Critical patent/JPWO2023054419A5/ja
Application granted granted Critical
Publication of JP7617296B2 publication Critical patent/JP7617296B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/209—Vertical interconnections, e.g. vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
JP2023551565A 2021-09-30 2022-09-28 半導体素子実装用基板及び半導体装置 Active JP7617296B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021161493 2021-09-30
JP2021161493 2021-09-30
PCT/JP2022/036055 WO2023054419A1 (ja) 2021-09-30 2022-09-28 半導体素子実装用基板及び半導体装置

Publications (3)

Publication Number Publication Date
JPWO2023054419A1 true JPWO2023054419A1 (https=) 2023-04-06
JPWO2023054419A5 JPWO2023054419A5 (https=) 2024-06-18
JP7617296B2 JP7617296B2 (ja) 2025-01-17

Family

ID=85782821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023551565A Active JP7617296B2 (ja) 2021-09-30 2022-09-28 半導体素子実装用基板及び半導体装置

Country Status (5)

Country Link
US (1) US20240413027A1 (https=)
EP (1) EP4411804A4 (https=)
JP (1) JP7617296B2 (https=)
CN (1) CN118043959A (https=)
WO (1) WO2023054419A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240027493A1 (en) * 2020-11-27 2024-01-25 Kyocera Corporation Wiring board and probe card
WO2025225641A1 (ja) * 2024-04-25 2025-10-30 京セラ株式会社 配線基板、パッケージ及び光モジュール

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243556A (ja) * 2002-02-19 2003-08-29 Murata Mfg Co Ltd 積層型基板装置
JP2014146759A (ja) * 2013-01-30 2014-08-14 Kyocera Corp 電子部品収納用パッケージおよびそれを用いた電子装置
WO2018021209A1 (ja) * 2016-07-28 2018-02-01 京セラ株式会社 半導体素子実装用基板および半導体装置
JP2020120076A (ja) * 2019-01-28 2020-08-06 京セラ株式会社 電子部品用パッケージおよび電子装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243556A (ja) * 2002-02-19 2003-08-29 Murata Mfg Co Ltd 積層型基板装置
JP2014146759A (ja) * 2013-01-30 2014-08-14 Kyocera Corp 電子部品収納用パッケージおよびそれを用いた電子装置
WO2018021209A1 (ja) * 2016-07-28 2018-02-01 京セラ株式会社 半導体素子実装用基板および半導体装置
JP2020120076A (ja) * 2019-01-28 2020-08-06 京セラ株式会社 電子部品用パッケージおよび電子装置

Also Published As

Publication number Publication date
CN118043959A (zh) 2024-05-14
EP4411804A1 (en) 2024-08-07
WO2023054419A1 (ja) 2023-04-06
US20240413027A1 (en) 2024-12-12
EP4411804A4 (en) 2025-07-23
JP7617296B2 (ja) 2025-01-17

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