CN118043959A - 半导体元件安装用基板以及半导体装置 - Google Patents

半导体元件安装用基板以及半导体装置 Download PDF

Info

Publication number
CN118043959A
CN118043959A CN202280065750.XA CN202280065750A CN118043959A CN 118043959 A CN118043959 A CN 118043959A CN 202280065750 A CN202280065750 A CN 202280065750A CN 118043959 A CN118043959 A CN 118043959A
Authority
CN
China
Prior art keywords
substrate
mounting
semiconductor element
conductor
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202280065750.XA
Other languages
English (en)
Chinese (zh)
Inventor
杉本好正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN118043959A publication Critical patent/CN118043959A/zh
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/209—Vertical interconnections, e.g. vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
CN202280065750.XA 2021-09-30 2022-09-28 半导体元件安装用基板以及半导体装置 Withdrawn CN118043959A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-161493 2021-09-30
JP2021161493 2021-09-30
PCT/JP2022/036055 WO2023054419A1 (ja) 2021-09-30 2022-09-28 半導体素子実装用基板及び半導体装置

Publications (1)

Publication Number Publication Date
CN118043959A true CN118043959A (zh) 2024-05-14

Family

ID=85782821

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280065750.XA Withdrawn CN118043959A (zh) 2021-09-30 2022-09-28 半导体元件安装用基板以及半导体装置

Country Status (5)

Country Link
US (1) US20240413027A1 (https=)
EP (1) EP4411804A4 (https=)
JP (1) JP7617296B2 (https=)
CN (1) CN118043959A (https=)
WO (1) WO2023054419A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240027493A1 (en) * 2020-11-27 2024-01-25 Kyocera Corporation Wiring board and probe card
WO2025225641A1 (ja) * 2024-04-25 2025-10-30 京セラ株式会社 配線基板、パッケージ及び光モジュール

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243556A (ja) 2002-02-19 2003-08-29 Murata Mfg Co Ltd 積層型基板装置
JP6224322B2 (ja) * 2013-01-30 2017-11-01 京セラ株式会社 電子部品収納用パッケージおよびそれを用いた電子装置
JP6853252B2 (ja) 2016-07-28 2021-03-31 京セラ株式会社 半導体素子実装用基板および半導体装置
JP7237609B2 (ja) * 2019-01-28 2023-03-13 京セラ株式会社 電子部品用パッケージおよび電子装置

Also Published As

Publication number Publication date
JPWO2023054419A1 (https=) 2023-04-06
EP4411804A1 (en) 2024-08-07
WO2023054419A1 (ja) 2023-04-06
US20240413027A1 (en) 2024-12-12
EP4411804A4 (en) 2025-07-23
JP7617296B2 (ja) 2025-01-17

Similar Documents

Publication Publication Date Title
US10790245B2 (en) High-frequency ceramic board and high-frequency semiconductor element package
CN111034372B (zh) 布线基板与柔性基板的连接构造及电子器件收纳用封装体
JP7049500B2 (ja) 半導体素子実装用基板および半導体装置
JP5636834B2 (ja) 高周波回路用パッケージ及び高周波回路装置
JP6243510B2 (ja) 電子部品収納用パッケージおよび電子装置
CN108352363B (zh) 布线基板、光半导体元件封装体以及光半导体装置
CN118043959A (zh) 半导体元件安装用基板以及半导体装置
JP5926290B2 (ja) 入出力部材ならびに電子部品収納用パッケージおよび電子装置
JPH11214556A (ja) 高周波用入出力端子ならびに高周波用半導体素子収納用パッケージ
JP6591912B2 (ja) 半導体素子パッケージおよび半導体装置
JP2002359443A (ja) 高周波パッケ−ジと配線基板との接続構造
JP2001189405A (ja) 高周波用入出力端子ならびに高周波用半導体素子収納用パッケージ
JP2024048912A (ja) 配線基板、配線基板を用いた配線構造体、電子部品実装用パッケージ、および電子モジュール
JP2000286364A (ja) 高周波用パッケージ
JP2004363276A (ja) 高周波回路モジュール
JPH07226458A (ja) 超高周波回路モジュールの製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WW01 Invention patent application withdrawn after publication
WW01 Invention patent application withdrawn after publication

Application publication date: 20240514