JPWO2023095681A1 - - Google Patents
Info
- Publication number
- JPWO2023095681A1 JPWO2023095681A1 JP2023563637A JP2023563637A JPWO2023095681A1 JP WO2023095681 A1 JPWO2023095681 A1 JP WO2023095681A1 JP 2023563637 A JP2023563637 A JP 2023563637A JP 2023563637 A JP2023563637 A JP 2023563637A JP WO2023095681 A1 JPWO2023095681 A1 JP WO2023095681A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/411—Chip-supporting parts, e.g. die pads
- H10W70/415—Leadframe inner leads serving as die pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/453—Leadframes comprising flexible metallic tapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021190267 | 2021-11-24 | ||
| PCT/JP2022/042404 WO2023095681A1 (ja) | 2021-11-24 | 2022-11-15 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023095681A1 true JPWO2023095681A1 (https=) | 2023-06-01 |
| JPWO2023095681A5 JPWO2023095681A5 (https=) | 2024-08-06 |
Family
ID=86539660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023563637A Pending JPWO2023095681A1 (https=) | 2021-11-24 | 2022-11-15 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240290693A1 (https=) |
| JP (1) | JPWO2023095681A1 (https=) |
| CN (1) | CN118382917A (https=) |
| DE (1) | DE112022005582T5 (https=) |
| WO (1) | WO2023095681A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3773679B2 (ja) * | 1998-11-20 | 2006-05-10 | 富士通株式会社 | テープキャリアパッケージ |
| JP4549491B2 (ja) * | 2000-03-13 | 2010-09-22 | 大日本印刷株式会社 | 樹脂封止型半導体装置 |
| JP2010258200A (ja) * | 2009-04-24 | 2010-11-11 | Panasonic Corp | 半導体装置およびその製造方法 |
| JP7199921B2 (ja) * | 2018-11-07 | 2023-01-06 | ローム株式会社 | 半導体装置 |
| JP7339000B2 (ja) * | 2019-03-18 | 2023-09-05 | ローム株式会社 | 半導体装置および半導体パッケージ |
-
2022
- 2022-11-15 CN CN202280077902.8A patent/CN118382917A/zh active Pending
- 2022-11-15 DE DE112022005582.0T patent/DE112022005582T5/de active Pending
- 2022-11-15 WO PCT/JP2022/042404 patent/WO2023095681A1/ja not_active Ceased
- 2022-11-15 JP JP2023563637A patent/JPWO2023095681A1/ja active Pending
-
2024
- 2024-05-09 US US18/659,791 patent/US20240290693A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023095681A1 (ja) | 2023-06-01 |
| CN118382917A (zh) | 2024-07-23 |
| DE112022005582T5 (de) | 2024-09-05 |
| US20240290693A1 (en) | 2024-08-29 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240502 |