DE112022005582T5 - Halbleiterbauteil - Google Patents

Halbleiterbauteil Download PDF

Info

Publication number
DE112022005582T5
DE112022005582T5 DE112022005582.0T DE112022005582T DE112022005582T5 DE 112022005582 T5 DE112022005582 T5 DE 112022005582T5 DE 112022005582 T DE112022005582 T DE 112022005582T DE 112022005582 T5 DE112022005582 T5 DE 112022005582T5
Authority
DE
Germany
Prior art keywords
terminal
electrode
semiconductor device
metal layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022005582.0T
Other languages
German (de)
English (en)
Inventor
Bin Zhang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE112022005582T5 publication Critical patent/DE112022005582T5/de
Pending legal-status Critical Current

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Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/415—Leadframe inner leads serving as die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE112022005582.0T 2021-11-24 2022-11-15 Halbleiterbauteil Pending DE112022005582T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-190267 2021-11-24
JP2021190267 2021-11-24
PCT/JP2022/042404 WO2023095681A1 (ja) 2021-11-24 2022-11-15 半導体装置

Publications (1)

Publication Number Publication Date
DE112022005582T5 true DE112022005582T5 (de) 2024-09-05

Family

ID=86539660

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022005582.0T Pending DE112022005582T5 (de) 2021-11-24 2022-11-15 Halbleiterbauteil

Country Status (5)

Country Link
US (1) US20240290693A1 (https=)
JP (1) JPWO2023095681A1 (https=)
CN (1) CN118382917A (https=)
DE (1) DE112022005582T5 (https=)
WO (1) WO2023095681A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3773679B2 (ja) * 1998-11-20 2006-05-10 富士通株式会社 テープキャリアパッケージ
JP4549491B2 (ja) * 2000-03-13 2010-09-22 大日本印刷株式会社 樹脂封止型半導体装置
JP2010258200A (ja) * 2009-04-24 2010-11-11 Panasonic Corp 半導体装置およびその製造方法
JP7199921B2 (ja) * 2018-11-07 2023-01-06 ローム株式会社 半導体装置
JP7339000B2 (ja) * 2019-03-18 2023-09-05 ローム株式会社 半導体装置および半導体パッケージ

Also Published As

Publication number Publication date
WO2023095681A1 (ja) 2023-06-01
CN118382917A (zh) 2024-07-23
US20240290693A1 (en) 2024-08-29
JPWO2023095681A1 (https=) 2023-06-01

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023500000

Ipc: H10W0072200000