JPWO2023140001A5 - - Google Patents
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- Publication number
- JPWO2023140001A5 JPWO2023140001A5 JP2023575137A JP2023575137A JPWO2023140001A5 JP WO2023140001 A5 JPWO2023140001 A5 JP WO2023140001A5 JP 2023575137 A JP2023575137 A JP 2023575137A JP 2023575137 A JP2023575137 A JP 2023575137A JP WO2023140001 A5 JPWO2023140001 A5 JP WO2023140001A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- insulating layer
- board according
- wiring board
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- 239000000463 material Substances 0.000 claims 4
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000002834 transmittance Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022008416 | 2022-01-24 | ||
| PCT/JP2022/046668 WO2023140001A1 (ja) | 2022-01-24 | 2022-12-19 | 配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023140001A1 JPWO2023140001A1 (https=) | 2023-07-27 |
| JPWO2023140001A5 true JPWO2023140001A5 (https=) | 2024-10-03 |
Family
ID=87348184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023575137A Pending JPWO2023140001A1 (https=) | 2022-01-24 | 2022-12-19 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP4472359A4 (https=) |
| JP (1) | JPWO2023140001A1 (https=) |
| CN (1) | CN118542075A (https=) |
| WO (1) | WO2023140001A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7574962B1 (ja) * | 2024-05-31 | 2024-10-29 | 大日本印刷株式会社 | 配線基板及びヘッドマウントディスプレイ |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4754850B2 (ja) * | 2004-03-26 | 2011-08-24 | パナソニック株式会社 | Ｌｅｄ実装用モジュールの製造方法及びｌｅｄモジュールの製造方法 |
| US9229260B2 (en) * | 2013-04-15 | 2016-01-05 | Eastman Kodak Company | Imprinted bi-layer micro-structure |
| WO2016051721A1 (ja) | 2014-09-30 | 2016-04-07 | パナソニックＩｐマネジメント株式会社 | タッチセンサおよび電子機器 |
| US12294042B2 (en) * | 2015-03-31 | 2025-05-06 | Creeled, Inc. | Light emitting diodes and methods with encapsulation |
| JP6717053B2 (ja) * | 2016-05-25 | 2020-07-01 | 凸版印刷株式会社 | 配線基板、タッチパネル、カラーフィルタ基板、及び表示装置 |
| JP2019197424A (ja) * | 2018-05-10 | 2019-11-14 | シャープ株式会社 | 配線基板、表示装置及び配線基板の製造方法 |
| CN113508033B (zh) * | 2019-03-26 | 2023-05-23 | 富士胶片株式会社 | 导电性层叠体、触摸面板、导电性层叠体的制造方法 |
| JP2021184405A (ja) * | 2020-05-21 | 2021-12-02 | パナソニックＩｐマネジメント株式会社 | 基板およびそれを備える表示装置 |
-
2022
- 2022-12-19 WO PCT/JP2022/046668 patent/WO2023140001A1/ja not_active Ceased
- 2022-12-19 EP EP22922151.0A patent/EP4472359A4/en active Pending
- 2022-12-19 JP JP2023575137A patent/JPWO2023140001A1/ja active Pending
- 2022-12-19 CN CN202280088986.5A patent/CN118542075A/zh active Pending
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