JPWO2024018795A5 - - Google Patents

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Publication number
JPWO2024018795A5
JPWO2024018795A5 JP2024534970A JP2024534970A JPWO2024018795A5 JP WO2024018795 A5 JPWO2024018795 A5 JP WO2024018795A5 JP 2024534970 A JP2024534970 A JP 2024534970A JP 2024534970 A JP2024534970 A JP 2024534970A JP WO2024018795 A5 JPWO2024018795 A5 JP WO2024018795A5
Authority
JP
Japan
Prior art keywords
semiconductor device
recess
connection portion
main surface
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024534970A
Other languages
English (en)
Japanese (ja)
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JPWO2024018795A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/022459 external-priority patent/WO2024018795A1/ja
Publication of JPWO2024018795A1 publication Critical patent/JPWO2024018795A1/ja
Publication of JPWO2024018795A5 publication Critical patent/JPWO2024018795A5/ja
Pending legal-status Critical Current

Links

JP2024534970A 2022-07-21 2023-06-16 Pending JPWO2024018795A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022116213 2022-07-21
PCT/JP2023/022459 WO2024018795A1 (ja) 2022-07-21 2023-06-16 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024018795A1 JPWO2024018795A1 (https=) 2024-01-25
JPWO2024018795A5 true JPWO2024018795A5 (https=) 2025-03-31

Family

ID=89617636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024534970A Pending JPWO2024018795A1 (https=) 2022-07-21 2023-06-16

Country Status (2)

Country Link
JP (1) JPWO2024018795A1 (https=)
WO (1) WO2024018795A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000031369A (ja) * 1998-07-07 2000-01-28 Hitachi Ltd 半導体装置およびその製造方法
JP5542627B2 (ja) * 2010-11-11 2014-07-09 新電元工業株式会社 接続板、接合構造及び半導体装置
JP7322054B2 (ja) * 2018-10-09 2023-08-07 ローム株式会社 半導体装置および半導体装置の製造方法
JP2021101453A (ja) * 2019-12-24 2021-07-08 三菱電機株式会社 半導体装置およびその製造方法ならびに電力変換装置
JP7341078B2 (ja) * 2020-02-07 2023-09-08 日立Astemo株式会社 半導体装置

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