JPWO2024018795A1 - - Google Patents
Info
- Publication number
- JPWO2024018795A1 JPWO2024018795A1 JP2024534970A JP2024534970A JPWO2024018795A1 JP WO2024018795 A1 JPWO2024018795 A1 JP WO2024018795A1 JP 2024534970 A JP2024534970 A JP 2024534970A JP 2024534970 A JP2024534970 A JP 2024534970A JP WO2024018795 A1 JPWO2024018795 A1 JP WO2024018795A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022116213 | 2022-07-21 | ||
| PCT/JP2023/022459 WO2024018795A1 (ja) | 2022-07-21 | 2023-06-16 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024018795A1 true JPWO2024018795A1 (https=) | 2024-01-25 |
| JPWO2024018795A5 JPWO2024018795A5 (https=) | 2025-03-31 |
Family
ID=89617636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024534970A Pending JPWO2024018795A1 (https=) | 2022-07-21 | 2023-06-16 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024018795A1 (https=) |
| WO (1) | WO2024018795A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000031369A (ja) * | 1998-07-07 | 2000-01-28 | Hitachi Ltd | 半導体装置およびその製造方法 |
| JP5542627B2 (ja) * | 2010-11-11 | 2014-07-09 | 新電元工業株式会社 | 接続板、接合構造及び半導体装置 |
| JP7322054B2 (ja) * | 2018-10-09 | 2023-08-07 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| JP2021101453A (ja) * | 2019-12-24 | 2021-07-08 | 三菱電機株式会社 | 半導体装置およびその製造方法ならびに電力変換装置 |
| JP7341078B2 (ja) * | 2020-02-07 | 2023-09-08 | 日立Astemo株式会社 | 半導体装置 |
-
2023
- 2023-06-16 JP JP2024534970A patent/JPWO2024018795A1/ja active Pending
- 2023-06-16 WO PCT/JP2023/022459 patent/WO2024018795A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024018795A1 (ja) | 2024-01-25 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241212 |