JPWO2025027821A5 - - Google Patents

Info

Publication number
JPWO2025027821A5
JPWO2025027821A5 JP2025538138A JP2025538138A JPWO2025027821A5 JP WO2025027821 A5 JPWO2025027821 A5 JP WO2025027821A5 JP 2025538138 A JP2025538138 A JP 2025538138A JP 2025538138 A JP2025538138 A JP 2025538138A JP WO2025027821 A5 JPWO2025027821 A5 JP WO2025027821A5
Authority
JP
Japan
Prior art keywords
semiconductor device
semiconductor
layer
surface bonding
elastic modulus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025538138A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025027821A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/028245 external-priority patent/WO2025027821A1/ja
Publication of JPWO2025027821A1 publication Critical patent/JPWO2025027821A1/ja
Publication of JPWO2025027821A5 publication Critical patent/JPWO2025027821A5/ja
Pending legal-status Critical Current

Links

JP2025538138A 2023-08-02 2023-08-02 Pending JPWO2025027821A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/028245 WO2025027821A1 (ja) 2023-08-02 2023-08-02 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2025027821A1 JPWO2025027821A1 (https=) 2025-02-06
JPWO2025027821A5 true JPWO2025027821A5 (https=) 2025-09-22

Family

ID=94394884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025538138A Pending JPWO2025027821A1 (https=) 2023-08-02 2023-08-02

Country Status (3)

Country Link
JP (1) JPWO2025027821A1 (https=)
CN (1) CN121694062A (https=)
WO (1) WO2025027821A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6613806B2 (ja) * 2015-10-23 2019-12-04 富士電機株式会社 半導体装置
US10461049B2 (en) * 2015-12-14 2019-10-29 Mitsubishi Electric Corporation Semiconductor device and manufacturing method therefor
JP2018026417A (ja) * 2016-08-09 2018-02-15 三菱電機株式会社 電力用半導体装置

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