CN121694062A - 半导体装置 - Google Patents

半导体装置

Info

Publication number
CN121694062A
CN121694062A CN202380100836.6A CN202380100836A CN121694062A CN 121694062 A CN121694062 A CN 121694062A CN 202380100836 A CN202380100836 A CN 202380100836A CN 121694062 A CN121694062 A CN 121694062A
Authority
CN
China
Prior art keywords
semiconductor
layer
electrode
surface bonding
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380100836.6A
Other languages
English (en)
Chinese (zh)
Inventor
川濑达也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN121694062A publication Critical patent/CN121694062A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
CN202380100836.6A 2023-08-02 2023-08-02 半导体装置 Pending CN121694062A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/028245 WO2025027821A1 (ja) 2023-08-02 2023-08-02 半導体装置

Publications (1)

Publication Number Publication Date
CN121694062A true CN121694062A (zh) 2026-03-17

Family

ID=94394884

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380100836.6A Pending CN121694062A (zh) 2023-08-02 2023-08-02 半导体装置

Country Status (3)

Country Link
JP (1) JPWO2025027821A1 (https=)
CN (1) CN121694062A (https=)
WO (1) WO2025027821A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6613806B2 (ja) * 2015-10-23 2019-12-04 富士電機株式会社 半導体装置
US10461049B2 (en) * 2015-12-14 2019-10-29 Mitsubishi Electric Corporation Semiconductor device and manufacturing method therefor
JP2018026417A (ja) * 2016-08-09 2018-02-15 三菱電機株式会社 電力用半導体装置

Also Published As

Publication number Publication date
WO2025027821A1 (ja) 2025-02-06
JPWO2025027821A1 (https=) 2025-02-06

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