JPWO2025027821A1 - - Google Patents
Info
- Publication number
- JPWO2025027821A1 JPWO2025027821A1 JP2025538138A JP2025538138A JPWO2025027821A1 JP WO2025027821 A1 JPWO2025027821 A1 JP WO2025027821A1 JP 2025538138 A JP2025538138 A JP 2025538138A JP 2025538138 A JP2025538138 A JP 2025538138A JP WO2025027821 A1 JPWO2025027821 A1 JP WO2025027821A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/028245 WO2025027821A1 (ja) | 2023-08-02 | 2023-08-02 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025027821A1 true JPWO2025027821A1 (https=) | 2025-02-06 |
| JPWO2025027821A5 JPWO2025027821A5 (https=) | 2025-09-22 |
Family
ID=94394884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025538138A Pending JPWO2025027821A1 (https=) | 2023-08-02 | 2023-08-02 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2025027821A1 (https=) |
| CN (1) | CN121694062A (https=) |
| WO (1) | WO2025027821A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6613806B2 (ja) * | 2015-10-23 | 2019-12-04 | 富士電機株式会社 | 半導体装置 |
| US10461049B2 (en) * | 2015-12-14 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device and manufacturing method therefor |
| JP2018026417A (ja) * | 2016-08-09 | 2018-02-15 | 三菱電機株式会社 | 電力用半導体装置 |
-
2023
- 2023-08-02 CN CN202380100836.6A patent/CN121694062A/zh active Pending
- 2023-08-02 JP JP2025538138A patent/JPWO2025027821A1/ja active Pending
- 2023-08-02 WO PCT/JP2023/028245 patent/WO2025027821A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN121694062A (zh) | 2026-03-17 |
| WO2025027821A1 (ja) | 2025-02-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250709 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250709 |