JPWO2023189480A5 - - Google Patents

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Publication number
JPWO2023189480A5
JPWO2023189480A5 JP2024511691A JP2024511691A JPWO2023189480A5 JP WO2023189480 A5 JPWO2023189480 A5 JP WO2023189480A5 JP 2024511691 A JP2024511691 A JP 2024511691A JP 2024511691 A JP2024511691 A JP 2024511691A JP WO2023189480 A5 JPWO2023189480 A5 JP WO2023189480A5
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JP
Japan
Prior art keywords
semiconductor device
layer
opening
thickness direction
viewed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024511691A
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English (en)
Japanese (ja)
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JPWO2023189480A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/009607 external-priority patent/WO2023189480A1/ja
Publication of JPWO2023189480A1 publication Critical patent/JPWO2023189480A1/ja
Publication of JPWO2023189480A5 publication Critical patent/JPWO2023189480A5/ja
Pending legal-status Critical Current

Links

JP2024511691A 2022-03-31 2023-03-13 Pending JPWO2023189480A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022058712 2022-03-31
PCT/JP2023/009607 WO2023189480A1 (ja) 2022-03-31 2023-03-13 半導体素子および半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023189480A1 JPWO2023189480A1 (https=) 2023-10-05
JPWO2023189480A5 true JPWO2023189480A5 (https=) 2024-12-11

Family

ID=88200900

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511691A Pending JPWO2023189480A1 (https=) 2022-03-31 2023-03-13

Country Status (3)

Country Link
US (1) US20250022821A1 (https=)
JP (1) JPWO2023189480A1 (https=)
WO (1) WO2023189480A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03153049A (ja) * 1989-11-10 1991-07-01 Fujitsu Ltd 半導体装置
JP5621712B2 (ja) * 2011-06-06 2014-11-12 株式会社デンソー 半導体チップ
JP6846117B2 (ja) * 2016-04-12 2021-03-24 ローム株式会社 半導体装置および半導体装置の製造方法

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