JPWO2023189480A5 - - Google Patents
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- Publication number
- JPWO2023189480A5 JPWO2023189480A5 JP2024511691A JP2024511691A JPWO2023189480A5 JP WO2023189480 A5 JPWO2023189480 A5 JP WO2023189480A5 JP 2024511691 A JP2024511691 A JP 2024511691A JP 2024511691 A JP2024511691 A JP 2024511691A JP WO2023189480 A5 JPWO2023189480 A5 JP WO2023189480A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- layer
- opening
- thickness direction
- viewed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 20
- 239000002184 metal Substances 0.000 claims 9
- 230000001681 protective effect Effects 0.000 claims 2
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000009719 polyimide resin Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022058712 | 2022-03-31 | ||
| PCT/JP2023/009607 WO2023189480A1 (ja) | 2022-03-31 | 2023-03-13 | 半導体素子および半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023189480A1 JPWO2023189480A1 (https=) | 2023-10-05 |
| JPWO2023189480A5 true JPWO2023189480A5 (https=) | 2024-12-11 |
Family
ID=88200900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024511691A Pending JPWO2023189480A1 (https=) | 2022-03-31 | 2023-03-13 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250022821A1 (https=) |
| JP (1) | JPWO2023189480A1 (https=) |
| WO (1) | WO2023189480A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03153049A (ja) * | 1989-11-10 | 1991-07-01 | Fujitsu Ltd | 半導体装置 |
| JP5621712B2 (ja) * | 2011-06-06 | 2014-11-12 | 株式会社デンソー | 半導体チップ |
| JP6846117B2 (ja) * | 2016-04-12 | 2021-03-24 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
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2023
- 2023-03-13 JP JP2024511691A patent/JPWO2023189480A1/ja active Pending
- 2023-03-13 WO PCT/JP2023/009607 patent/WO2023189480A1/ja not_active Ceased
-
2024
- 2024-09-26 US US18/898,031 patent/US20250022821A1/en active Pending