JPWO2025013528A1 - - Google Patents
Info
- Publication number
- JPWO2025013528A1 JPWO2025013528A1 JP2025532461A JP2025532461A JPWO2025013528A1 JP WO2025013528 A1 JPWO2025013528 A1 JP WO2025013528A1 JP 2025532461 A JP2025532461 A JP 2025532461A JP 2025532461 A JP2025532461 A JP 2025532461A JP WO2025013528 A1 JPWO2025013528 A1 JP WO2025013528A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023113600 | 2023-07-11 | ||
| PCT/JP2024/021855 WO2025013528A1 (ja) | 2023-07-11 | 2024-06-17 | 電子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025013528A1 true JPWO2025013528A1 (https=) | 2025-01-16 |
| JPWO2025013528A5 JPWO2025013528A5 (https=) | 2026-04-10 |
Family
ID=94215557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025532461A Pending JPWO2025013528A1 (https=) | 2023-07-11 | 2024-06-17 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2025013528A1 (https=) |
| WO (1) | WO2025013528A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6661102B1 (en) * | 2002-01-18 | 2003-12-09 | Advance Micro Devices, Inc. | Semiconductor packaging apparatus for controlling die attach fillet height to reduce die shear stress |
| DE102016114463B4 (de) * | 2016-08-04 | 2019-10-17 | Infineon Technologies Ag | Die-befestigungsverfahren und halbleiterbauelemente, die auf der grundlage solcher verfahren hergestellt werden |
| US12588520B2 (en) * | 2020-01-23 | 2026-03-24 | Rohm Co., Ltd. | Electronic device and method for manufacturing electronic device |
| JP7845824B2 (ja) * | 2021-03-17 | 2026-04-14 | ローム株式会社 | 半導体装置 |
-
2024
- 2024-06-17 JP JP2025532461A patent/JPWO2025013528A1/ja active Pending
- 2024-06-17 WO PCT/JP2024/021855 patent/WO2025013528A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025013528A1 (ja) | 2025-01-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260105 |