JP2022536515A5 - - Google Patents
Info
- Publication number
- JP2022536515A5 JP2022536515A5 JP2021573729A JP2021573729A JP2022536515A5 JP 2022536515 A5 JP2022536515 A5 JP 2022536515A5 JP 2021573729 A JP2021573729 A JP 2021573729A JP 2021573729 A JP2021573729 A JP 2021573729A JP 2022536515 A5 JP2022536515 A5 JP 2022536515A5
- Authority
- JP
- Japan
- Prior art keywords
- die
- metal pad
- package
- layer
- protective overcoat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025002826A JP7741340B2 (ja) | 2019-06-12 | 2025-01-08 | 複数ダイを備えるｉｃパッケージ |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962860593P | 2019-06-12 | 2019-06-12 | |
| US62/860,593 | 2019-06-12 | ||
| US16/897,996 US11616048B2 (en) | 2019-06-12 | 2020-06-10 | IC package with multiple dies |
| US16/897,996 | 2020-06-10 | ||
| PCT/US2020/037482 WO2020252299A1 (en) | 2019-06-12 | 2020-06-12 | Ic package with multiple dies |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025002826A Division JP7741340B2 (ja) | 2019-06-12 | 2025-01-08 | 複数ダイを備えるｉｃパッケージ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022536515A JP2022536515A (ja) | 2022-08-17 |
| JP2022536515A5 true JP2022536515A5 (https=) | 2023-06-16 |
| JP7618594B2 JP7618594B2 (ja) | 2025-01-21 |
Family
ID=73782257
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021573729A Active JP7618594B2 (ja) | 2019-06-12 | 2020-06-12 | 複数ダイを備えるｉｃパッケージ |
| JP2025002826A Active JP7741340B2 (ja) | 2019-06-12 | 2025-01-08 | 複数ダイを備えるｉｃパッケージ |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025002826A Active JP7741340B2 (ja) | 2019-06-12 | 2025-01-08 | 複数ダイを備えるｉｃパッケージ |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US11616048B2 (https=) |
| JP (2) | JP7618594B2 (https=) |
| CN (2) | CN117059500A (https=) |
| WO (1) | WO2020252299A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12278206B2 (en) * | 2022-01-27 | 2025-04-15 | Airoha Technology (HK) Limited | Semiconductor package with conductive adhesive that overflows for return path reduction and associated method |
| WO2025240564A1 (en) * | 2024-05-17 | 2025-11-20 | Micron Technology, Inc. | Self-aligned patterning on package substrate |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0583011A (ja) * | 1991-09-25 | 1993-04-02 | Sumitomo Electric Ind Ltd | 半導体装置用パツケージの入出力結合デバイス |
| US6728113B1 (en) * | 1993-06-24 | 2004-04-27 | Polychip, Inc. | Method and apparatus for non-conductively interconnecting integrated circuits |
| US7288940B2 (en) | 2004-12-06 | 2007-10-30 | Analog Devices, Inc. | Galvanically isolated signal conditioning system |
| JP2006253330A (ja) | 2005-03-09 | 2006-09-21 | Sharp Corp | 半導体装置およびその製造方法 |
| US7535105B2 (en) * | 2005-08-02 | 2009-05-19 | International Business Machines Corporation | Inter-chip ESD protection structure for high speed and high frequency devices |
| US20080157316A1 (en) | 2007-01-03 | 2008-07-03 | Advanced Chip Engineering Technology Inc. | Multi-chips package and method of forming the same |
| CN102460686B (zh) | 2009-06-30 | 2016-01-06 | 日本电气株式会社 | 半导体器件、用于半导体器件的安装基板以及制造安装基板的方法 |
| KR101532816B1 (ko) * | 2011-11-14 | 2015-06-30 | 유나이티드 테스트 엔드 어셈블리 센터 엘티디 | 반도체 패키지 및 반도체 소자 패키징 방법 |
| US9318274B2 (en) | 2012-07-13 | 2016-04-19 | Empire Technology Development Llc | Fabrication of nano-structure electrodes for ultra-capacitor |
| US8890223B1 (en) | 2013-08-06 | 2014-11-18 | Texas Instruments Incorporated | High voltage hybrid polymeric-ceramic dielectric capacitor |
| JP6271221B2 (ja) * | 2013-11-08 | 2018-01-31 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US9685425B2 (en) | 2014-01-28 | 2017-06-20 | Apple Inc. | Integrated circuit package |
| US20180175741A1 (en) | 2015-06-16 | 2018-06-21 | Npc Tech Aps | A galvanically isolated resonant power converter assembly |
| US20170025388A1 (en) * | 2015-07-22 | 2017-01-26 | Microchip Technology Incorporated | Backside Stacked Die In An Integrated Circuit (IC) Package |
| JP6524986B2 (ja) * | 2016-09-16 | 2019-06-05 | 株式会社村田製作所 | 高周波モジュール、アンテナ付き基板、及び高周波回路基板 |
| US10523175B2 (en) | 2017-03-23 | 2019-12-31 | Texas Instruments Incorporated | Low loss galvanic isolation circuitry |
| CN109524364B (zh) | 2017-09-19 | 2023-09-26 | 恩智浦美国有限公司 | 具有堆叠管芯的封装式集成电路和其方法 |
| US10444432B2 (en) | 2017-10-31 | 2019-10-15 | Texas Instruments Incorporated | Galvanic signal path isolation in an encapsulated package using a photonic structure |
| US10790757B2 (en) | 2017-12-08 | 2020-09-29 | Texas Instruments Incorporated | Galvanic isolation devices to provide power and data between subsystems |
| EP3598409B1 (en) * | 2018-07-16 | 2021-03-10 | Melexis Technologies NV | Transceiver with galvanic isolation means |
-
2020
- 2020-06-10 US US16/897,996 patent/US11616048B2/en active Active
- 2020-06-12 WO PCT/US2020/037482 patent/WO2020252299A1/en not_active Ceased
- 2020-06-12 JP JP2021573729A patent/JP7618594B2/ja active Active
- 2020-06-12 CN CN202311075495.XA patent/CN117059500A/zh active Pending
- 2020-06-12 CN CN202080038131.2A patent/CN113853836B/zh active Active
-
2023
- 2023-03-20 US US18/186,608 patent/US12489088B2/en active Active
-
2025
- 2025-01-08 JP JP2025002826A patent/JP7741340B2/ja active Active
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