WO2020252299A1 - Ic package with multiple dies - Google Patents

Ic package with multiple dies Download PDF

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Publication number
WO2020252299A1
WO2020252299A1 PCT/US2020/037482 US2020037482W WO2020252299A1 WO 2020252299 A1 WO2020252299 A1 WO 2020252299A1 US 2020037482 W US2020037482 W US 2020037482W WO 2020252299 A1 WO2020252299 A1 WO 2020252299A1
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WO
WIPO (PCT)
Prior art keywords
die
metal pad
layer
package
protective overcoat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2020/037482
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English (en)
French (fr)
Inventor
Thomas Dyer BONIFIELD
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Japan Ltd
Texas Instruments Inc
Original Assignee
Texas Instruments Japan Ltd
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Japan Ltd, Texas Instruments Inc filed Critical Texas Instruments Japan Ltd
Priority to CN202311075495.XA priority Critical patent/CN117059500A/zh
Priority to JP2021573729A priority patent/JP7618594B2/ja
Priority to CN202080038131.2A priority patent/CN113853836B/zh
Publication of WO2020252299A1 publication Critical patent/WO2020252299A1/en
Anticipated expiration legal-status Critical
Priority to JP2025002826A priority patent/JP7741340B2/ja
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/293—Configurations of stacked chips characterised by non-galvanic coupling between the chips, e.g. capacitive coupling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/342—Dispositions of die-attach connectors, e.g. layouts relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/865—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/28—Configurations of stacked chips the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • This description relates to integrated circuit (IC) packages, and more particularly, to an IC package with multiple dies.
  • Galvanic isolation is a principle of isolating functional sections of electrical systems to prevent current flow, such that a direct conduction path is not permitted. Energy or information can still be exchanged between the sections by other mechanisms, such as capacitance, induction or electromagnetic waves. Galvanic isolation is used where two or more electric circuits communicate, but each such electric circuit have grounds that may be at different potentials. Galvanic isolation is an effective method of breaking ground loops by preventing unwanted current from flowing between two units sharing a ground conductor. Galvanic isolation is also used for safety, preventing accidental current from reaching ground through a person's body.
  • Capacitors can provide galvanic isolation by allowing alternating current (AC) to flow, but blocking direct current. Accordingly, capacitors can couple AC signals between circuits at different direct voltages.
  • AC alternating current
  • a first example relates to an integrated circuit (IC) package that includes a first die with a first surface overlaying a substrate.
  • the first die includes a first metal pad at a second surface opposing the first surface and a dielectric layer having a first surface contacting the second surface of the first die.
  • the IC package also includes a second die with a surface that contacts a second surface of the dielectric layer.
  • the second die includes a second metal pad aligned with the first metal pad of the first die. A plane perpendicular to the second surface of the first die intersects the first metal pad and the second metal pad.
  • a second example relates to an IC package.
  • the IC package includes a first die with a first surface overlaying a first substrate, wherein the first die includes a first metal pad at a second surface opposing the first surface.
  • the IC package also includes a second die comprising a second metal pad aligned with the first metal pad.
  • a first protective overcoat layer contacts the second surface of the first die.
  • the first protective overcoat layer includes a first recess that exposes a third metal pad positioned at the second surface of the first die.
  • a second protective overcoat layer contacts a first surface of the second die.
  • a non-conductive die adhesive (NCDA) layer is sandwiched between the first protective overcoat and the second protective overcoat.
  • NCDA non-conductive die adhesive
  • the NCDA layer overlays a portion of the first protective overcoat layer that is spaced apart from the first recess.
  • the first metal pad and the second metal pad form a capacitor that couples the first die with the second die.
  • the IC package further includes a second substrate that contacts a second surface of the second die. A second recess that extend through the second substrate and an insulating layer of the second die exposes a portion of a metal layer to provide a fourth metal pad.
  • a third example relates to a method for forming an IC package.
  • the method includes applying a protective overcoat to a first die wafer that includes a first die and a second die wafer that includes a second die.
  • a first surface of the first die overlays a substrate and a second surface of the first die includes a first metal pad.
  • the second surface of the first die opposes the first surface of the first die.
  • the method includes singulating the first die from the first die wafer and the second die from the second die wafer.
  • the method also includes applying an NCDA layer to the second surface of the first die and aligning a second metal pad positioned on a surface of the second die with the first metal pad of the first die.
  • the method further includes adhering the second die to the NCDA layer to form a capacitor with the first metal pad and the second metal pad.
  • the capacitor couples the first die with the second die.
  • FIG. 1 illustrates a diagram of an example of an integrated circuit (IC) package with a first die and a second die that are galvanically isolated.
  • IC integrated circuit
  • FIG. 2 illustrates another example of an IC package with a first die and a second die that are galvanically isolated.
  • FIG. 3 illustrates yet another example of an IC package with a first die and a second die that are galvanically isolated.
  • FIG. 4 illustrates a flowchart of an example method of forming an IC package.
  • FIG. 5 illustrates a first stage of packaging for the IC package formed by the method of FIG. 4.
  • FIG. 6 illustrates a second stage of packaging for the IC package formed by the method of FIG. 4.
  • FIG. 7 illustrates a third stage of packaging for the IC package formed by the method of FIG. 4.
  • FIG. 8 illustrates a fourth stage of packaging for the IC package formed by the method of FIG. 4.
  • FIG. 9 illustrates a flowchart of another example method of forming an IC package.
  • FIG. 10 illustrates a first stage of packaging for the IC package formed by the method of FIG. 9.
  • FIG. 11 illustrates a second stage of packaging for the IC package formed by the method of FIG. 9.
  • FIG. 12 illustrates a third stage of packaging for the IC package formed by the method of FIG. 9.
  • FIG. 13 illustrates a fourth stage of packaging for the IC package formed by the method of FIG. 9.
  • FIG. 14 illustrates a fifth stage of packaging for the IC package formed by the method of FIG. 9.
  • This description relates to an integrated circuit (IC) package with a first die and a second die that are galvanically isolated and capacitively coupled.
  • the first die and the second die include embedded circuits.
  • the circuits embedded in the first die may have a ground at a different potential than a ground of the circuits embedded in the second die.
  • the first die has a first surface that overlays a first substrate, and the first die has a first metal pad at a second surface opposing the first surface.
  • a first protective overcoat contacts the second surface of the first die.
  • the second die has a first surface that contacts a second protective overcoat.
  • the second die includes a second metal pad aligned with the first metal pad. The first metal pad and the second metal pad form nodes of a capacitor that couples the first die with the second die.
  • a non-conductive die adhesive (NCDA) layer is sandwiched between the first protective overcoat and the second protective overcoat.
  • NCDA non-conductive die adhesive
  • multiple NCDA layers and/or a spacer are sandwiched between the first protective overcoat and the second protective overcoat.
  • the combination of the first protective overcoat, the second protective overcoat, the NCDA layer (and/or other layers) intervening between the first metal pad of the first die and the second metal pad of the second die form a dielectric layer.
  • the first metal pad of the first die and the second metal pad of the second die are separated by the dielectric layer, thereby forming the capacitor to capacitively couple the first die to the second die.
  • wire bonds are employable to couple the first die and the second die to other components, such as other dies and/or external leads of the IC package. More particularly, a first recess in the first protective overcoat exposes a third metal contact positioned on the second surface of the first die. Similarly, a second substrate (e.g., formed of silicon) contacts a second surface of the second die. The second substrate includes a second recess that exposes a fourth metal pad positioned at the second surface of the second die. Wire bonds are coupled to the respective third and fourth metal pads to couple the first die and the second die to the other components of the IC package.
  • a first recess in the first protective overcoat exposes a third metal contact positioned on the second surface of the first die.
  • a second substrate e.g., formed of silicon contacts a second surface of the second die. The second substrate includes a second recess that exposes a fourth metal pad positioned at the second surface of the second die. Wire bonds are coupled to the respective third and fourth metal pads
  • FIG. 1 illustrates a diagram of an example of an IC package 100 in a condition for completing packaging.
  • the IC package 100 includes a first die 102 and a second die 104.
  • the first die 102 and the second die 104 include respective embedded circuits.
  • the second die 104 superposes the first die 102, and the first die 102 and the second die 104 are separated by a dielectric layer 106.
  • a first surface 108 of the first die 102 overlays a substrate 116.
  • the substrate 116 can be formed of silicon.
  • a second surface 118 of the first die 102 opposes the first surface 108.
  • the second surface 118 of the first die 102 is referred to as a face of the first die 102.
  • the second surface 118 of the first die 102 underlies the dielectric layer 106, such that a first surface 119 of the dielectric layer 106 contacts the second surface of the first die 102.
  • the second die 104 includes a first surface 120 and a second surface 122.
  • the second surface 122 of the second die 104 opposes the first surface 120 of the second die 104.
  • the second die 104 has a smaller footprint than the first die 102.
  • the footprint of a die refers to an area of a surface of a respective die.
  • the first surface 120 of the second die 104 contacts a second surface 121 of the dielectric layer 106.
  • the second surface 121 of the dielectric layer 106 opposes the first surface 119 of the dielectric layer 106.
  • the dielectric layer 106 is implemented with a protective overcoat for the first die and the second die, as well as a single layer of homogenous material, such as a non-conductive die adhesive (NCDA) layer, such as a layer formed of an epoxy.
  • NCA non-conductive die adhesive
  • the dielectric layer 106 can be implemented with multiple layers of heterogenous material, such as the protective overcoat for the first die and the second die, multiple layers of an NCDA and a spacer interposed between the multiple layers of the NCDA.
  • the first die 102 and the second die 104 include embedded circuits.
  • the first die 102 and the second die 104 can be formed with different materials and/or processing techniques. In this manner, the materials and/or processing techniques for fabricating the first die 102 and the second die 104 are individually selectable based on the operating parameters (e.g., maximum voltage) of the first die 102 and the second die 104.
  • the arrangement of the first die 102 and the second die 104 is referred to as a face-to-face configuration.
  • the first die 102 includes a first metal pad 130 (e.g., a connector) and the second die 104 includes a second metal pad 132.
  • the first metal pad 130 and the second metal pad 132 are congruent and aligned. Accordingly, in one orientation, a plane, such as the plane 136 that extends perpendicular to the second surface 118 of the first die 102 intersects the first metal pad 130 and the second metal pad 132.
  • the first metal pad 130 forms a first node of a capacitor 140 and the second metal pad 132 forms a second node of the capacitor 140.
  • the first die 102 and the second die 104 are galvanically isolated and capacitively coupled through the capacitor 140. In this manner, circuits embedded in the first die 102 communicate with circuits embedded in the second die 104 through the capacitor 140. Because the first die 102 and the second die 104 are galvanically isolated, in some examples, the first die 102 and the second die 104 have grounds at different potentials. In one example of a high voltage application, the ground of the first die 102 has a high voltage difference from the ground of the second die 104 (e.g., a voltage difference of about 40 volts (V) or more).
  • V volts
  • the ground voltage of the first die 102 may be 1 kilovolt (kV) or more greater than the ground voltage of the second die 104.
  • the first die 102 includes a third metal pad 150 positioned on the second surface 118 of the first die 102.
  • a first wire bond 152 is coupled to the third metal pad 150.
  • a fourth metal pad 154 is positioned on the second surface 122 of the second die 104.
  • a second wire bond 156 is coupled to the fourth metal pad 154.
  • the first wire bond 152 and the second wire bond 156 are coupled to other components of the IC package, such as other dies and/or the leads of the IC package.
  • the IC package 100 provides a simple design that achieves galvanic isolation. Moreover, in some examples, the IC package 100 achieves basic isolation, and in other examples, the IC package 100 achieves reinforced isolation. Also, as noted, the first die 102 and the second die 104 embed circuits that have different ground potentials. The wafer materials and processing techniques selected for the particular voltage range and/or other operational parameters of the first die 102 and the second die 104 are employable. In contrast, in situations where the circuits of the first die 102 and the second die 104 are integrated on a particular technology which provides the isolation, a designer would be limited to using that single particular type of materials and processing techniques.
  • FIG. 2 illustrates a detailed diagram of an example of an IC package 200 in a condition for completing packaging.
  • the IC package 200 can be employed to implement the IC package 100 of FIG. 1.
  • the IC package 200 includes a first die 202 and a second die 204 that are galvanically isolated.
  • a first surface 208 of the first die 202 overlays a first substrate 210.
  • the first substrate 210 can be formed of silicon.
  • a first protective overcoat 212 is applied to a second surface 214 of the first die 202, and the second surface 214 opposes the first surface 208.
  • the second surface 214 of the first die 202 is referred to as a face of the first die 202.
  • the second die 204 includes a first surface 220 and a second surface 222.
  • the second surface 222 of the second die 204 opposes the first surface 220 of the second die 204.
  • the first surface 220 of the second die 204 is referred to as a face of the second die 204.
  • the second die 204 has a smaller footprint than the first die 202.
  • a second protective overcoat 224 is adhered to the first surface 220 of the second die 204.
  • the first die 202 and the second die 204 include embedded circuits.
  • the first die 202 and the second die 204 can be formed with different materials and/or processing techniques. In this manner, the materials and/or processing techniques for fabricating the first die 202 and the second die 204 are individually selectable based on the operating parameters of the first die 202 and the second die 204.
  • NCDA layer 226 is adhered to the first protective overcoat 212 and the second protective overcoat 224. Stated differently, the NCDA layer 226 is sandwiched between the first protective overcoat 212 and the second protective overcoat 224. In some examples, the NCDA layer 226 is implemented with an epoxy.
  • the arrangement of the first die 202 and the second die 204 is referred to as a face-to-face configuration.
  • the first die 202 includes a first metal pad 230 (e.g., a connector) and the second die 204 includes a second metal pad 232.
  • the first metal pad 230 and the second metal pad 232 can each have a diameter ranging from 40 to 200 micrometers (pm).
  • the first metal pad 230 and the second metal pad 232 are congruent and aligned, within manufacture tolerances (e.g., ⁇ 10 pm).
  • a plane such as the plane 236 that extends perpendicular to the second surface 214 of the first die 202 intersects the first metal pad 230 and the second metal pad 232.
  • the first metal pad 230 forms a first node of a capacitor 240 and the second metal pad 232 forms a second node of the capacitor 240.
  • the first protective overcoat 212 and the second protective overcoat 224 can each be formed of a stack of materials.
  • the first protective overcoat 212 and the second protective overcoat 224 can be formed with a first layer of silicon dioxide (S1O2) that is at least about 1 pm (e.g., ⁇ 0.7 pm) thick, a second layer of silicon oxynitride (SiON) that is at least about 1 pm (e.g., ⁇ 0.7 pm) thick and a third layer of silicon dioxide (S1O2) that is at least about 10 pm (e.g., ⁇ 8 pm) thick.
  • the NCDA layer 226 can have a thickness of at least about 6 pm (e.g., ⁇ 4 pm).
  • a combination of the first protective overcoat 212, the second protective overcoat 224 and the NCDA layer 226 are employable to implement the dielectric layer 106 of FIG. 1.
  • the first metal pad 230 and the second metal pad 232 are separated by a distance of about 30 pm (e.g., ⁇ 22.8 pm).
  • the first die 202 and the second die 204 are galvanically isolated and capacitively coupled through the capacitor 240. In this manner, circuits embedded in the first die 202 can communicate with circuits embedded in the second die 204 through the capacitor 240 and vice versa. Because the first die 202 and the second die 204 are galvanically isolated, in some examples, the first die 202 and the second die 204 have grounds at different potentials. In one example of a high voltage application, the ground of the first die 202 has a high voltage difference from the ground of the second die 204 (e.g., a voltage difference of about 40 V or more).
  • the ground voltage of the first die 202 may be 1 kV or more greater than the ground voltage of the second die 204.
  • a first recess 242 is etched in the first protective overcoat 212.
  • the first recess 242 in the first protective overcoat 212 exposes a third metal pad 250 positioned on the second surface 214 of the first die 202.
  • the first recess 242 is spaced apart from the NCDA layer 226.
  • the first NCDA layer 226 is applied to a portion of the first protective overcoat 212 overlaying the first die 202 that is spaced apart from the first recess 242. Accordingly, the first NCDA layer 226 does not overlay or otherwise cover the first recess 242.
  • a first wire bond 252 is coupled to the third metal pad 250.
  • a second substrate 254 contacts the second surface 222 of the second die 204. More particularly, the second surface 222 is proximal to an insulating layer 255 of the second die 205, and the second substrate 254 contacts the insulating layer 255 of the second die 205.
  • a second recess 256 formed with back processing techniques is etched in the second substrate 254 and the insulating layer 255 of the second die 204 to expose a portion of a metal layer within the second die 204 to provide a fourth metal pad 260. Accordingly, in some examples, openings in the second substrate 254 and the insulating layer 255 that form the recess 256 are self-aligned.
  • the insulating layer 255 of the second die 204 separates the fourth metal pad 260 from the substrate 254.
  • a second wire bond 262 is coupled to the fourth metal pad 260.
  • the first wire bond 252 and the second wire bond 262 can be coupled to other components of the IC package 200, such as other dies and/or external leads of the IC package 200.
  • the IC package 200 provides a simple design that achieves galvanic isolation. Moreover, in some examples, the IC package 200 achieves basic isolation, and in other examples, the IC package 200 achieves reinforced isolation. Also, as noted, in some examples, the first die 202 and the second die 204 embed circuits that have different maximum voltages. Accordingly, wafer materials and processes selected for the particular voltage range and/or other operational parameters of the first die 202 and the second die 204 are employable. In contrast, in situations where the circuits of the first die 202 and the second die 204 are integrated with a single technology, a designer would be limited to using a single type of materials and processing techniques.
  • FIG. 3 illustrates a detailed diagram of an IC package 300 in a condition for completing packaging.
  • the IC package 300 can be employed to implement the IC package 100 of FIG. 1.
  • the IC package 300 includes a first die 302 and a second die 304 that are galvanically isolated.
  • a first surface 308 of the first die 302 overlays a first substrate 310.
  • the first substrate 310 can be silicon.
  • a first protective overcoat 312 is applied to a second surface 316 of the first die 302, and the second surface 316 opposes the first surface 308.
  • the second surface 316 of the first die 302 is referred to as a face of the first die 302.
  • the second die 304 includes a first surface 320 and a second surface 322.
  • the second surface 322 of the second die 304 opposes the first surface 320 of the second die 304.
  • the first surface 320 of the second die 304 is referred to as a face of the second die 304.
  • the second die 304 has a smaller footprint than the first die 302.
  • a second protective overcoat 324 is adhered to the first surface 320 of the second die 304.
  • the first die 302 and the second die 304 include embedded circuits.
  • the first die 302 and the second die 304 can be formed with different materials and/or processing techniques. In this manner, the materials and/or processing techniques for fabricating the first die 302 and the second die 304 are individually selectable based on the operating parameters of the first die 302 and the second die 304.
  • a spacer plate 326 is sandwiched between the first protective overcoat 312 and the second protective overcoat 324.
  • the spacer plate 326 is formed of a non-conductive material.
  • the spacer plate 326 is formed with silicon dioxide (Si0 2 ) materials such as fused silica or quartz.
  • a first NCDA layer 328 is adhered to the first protective overcoat 312 and the spacer plate 326. Thus, the first NCDA layer 328 is sandwiched between the first protective overcoat 312 and the spacer plate 326.
  • a second NCDA layer 330 is adhered to the second protective overcoat 324. Thus, the second NCDA layer 330 is sandwiched between the second protective overcoat 324 and the spacer plate 326.
  • the first NCDA layer 328 and the second NCDA layer 330 is formed with an epoxy.
  • the arrangement of the first die 302 and the second die 304 is referred to as a face-to-face configuration.
  • the first die 302 includes a first metal pad 332 (e.g., a connector) and the second die 304 includes a second metal pad 334.
  • the first metal pad 332 and the second metal pad 334 can each have a diameter of about 120 pm (e.g., ⁇ 80 pm).
  • the second die 304 is aligned with the first die 302 such that the first metal pad 332 and the second metal pad 334 are congruent and aligned within manufacture tolerances (e.g., ⁇ 10 pm).
  • a plane such as the plane 338 that extends perpendicular to the second surface 316 of the first die 302 intersects the first metal pad 332 and the second metal pad 334.
  • the first metal pad 332 forms a first node of a capacitor 340 and the second metal pad 334 forms a second node of the capacitor 340.
  • the IC package 300 has a thinner first protective overcoat 312 and a thinner second protective overcoat 324.
  • the spacer plate 326 compensates for the reduced thickness of the first protective overcoat 312 and the second protective overcoat 324.
  • the first protective overcoat 312 and the second protective overcoat 324 can each be formed of a stack of materials.
  • the first protective overcoat 312 and the second protective overcoat 324 can be formed with a first layer of silicon dioxide (S1O2) that is at least about 1 pm (e.g., ⁇ 0.7 pm) thick and a second layer of silicon oxynitride (SiON) that is at least about 1 pm (e.g., ⁇ 0.7 pm) thick.
  • the first NCDA layer 328 and the second NCDA layer 330 have a thickness of at least about 6 pm (e.g., ⁇ 4 pm) thick.
  • the spacer plate 326 has a thickness of at least about 20 pm (e.g., ⁇ 10 pm).
  • a combination of the first protective overcoat 312, the second protective overcoat 324, the first NCDA layer 328, the second NCDA layer 330 and the spacer plate 326 can be employed to implement the dielectric layer 106 of FIG. 1.
  • the first metal pad 332 and the second metal pad 334 are separated by a distance of about 36 pm (e.g., ⁇ 20.8 pm).
  • the first die 302 and the second die 304 are galvanically isolated and capacitively coupled through the capacitor 340. In this manner, circuits embedded in the second die 304 can communicate with circuits embedded in the second die 304 through the capacitor 340 and vice versa. Because the first die 302 and the second die 304 are galvanically isolated, the first die 302 and the second die 304 have different ground potentials. In one example of a high voltage application, the ground of the first die 302 has a high voltage difference from the ground of the second die 304 (e.g., a voltage difference of about 40 V or more).
  • the ground voltage of the first die 302 may be 1 kV or more greater than the ground voltage of the second die 304.
  • a first recess 342 is etched in the first protective overcoat 312.
  • the first recess 342 in the first protective overcoat 312 exposes a third metal pad 350 positioned on the second surface 316 of the first die 302.
  • the first recess 342 is spaced apart from the first NCDA layer 328.
  • the first NCDA layer 328 is applied to a portion of the first protective overcoat 312 overlaying the first die 302 that is spaced apart from the first recess 342. Accordingly, the first NCDA layer 342 does not overlay or otherwise cover the first recess 342.
  • a first wire bond 352 is coupled to the third metal pad 350.
  • a second substrate 354 contacts the second surface 322 of the second die 304. More particularly, the second die 304 includes an insulating layer 355 that is proximal to the second surface 322 of the second die 304. Accordingly, the second substrate 354 contacts the insulating layer 355 of the second die 304 in some examples.
  • a second recess 356 etched in the second substrate 354 and the insulating layer 355 of the second die 304 with back-processing techniques exposes a portion of a metal layer of the second die 304 to provide a fourth metal pad 360 within the second die 304.
  • openings formed in the second substrate 354 and the insulating layer 355 of the second die 304 that form the second recess 356 are self-aligned.
  • the insulating layer 355 of the second die 304 separates the fourth metal pad 360 from the substrate 354.
  • a second wire bond 362 is coupled to the fourth metal pad 360.
  • the first wire bond 352 and the second wire bond 362 are coupled to other components of the IC package 300, such as other dies and/or external leads of the IC package 300.
  • the IC package 300 provides a simple design that achieves galvanic isolation. Moreover, in some examples, the IC package 300 achieves basic isolation, and in other examples, the IC package 300 achieves reinforced isolation. Also, as noted, in some examples, the first die 302 and the second die 304 embed circuits that have different maximum voltages. Accordingly, wafer materials and processing techniques selected for the particular voltage range and/or other operational properties of the first die 302 and the second die 304 are employable. In contrast, in situations where the circuits of the first die 302 and the second die 304 are integrated on a single die, a designer would be limited to using a single type of materials and processing techniques. [0055] FIG. 4 illustrates a method 400 for forming an IC package.
  • the method 400 could be employed for example, to form the IC package 100 of FIG. 1 and/or the IC package 200 of FIG. 2.
  • the IC package includes a first die and a second die, such as the first die 202 and the second die 204 of FIG. 2.
  • the method 400 is demonstrated with FIGS. 5-8.
  • FIGS. 5-8 illustrate stages of fabrication of the IC package 200 of FIG. 2.
  • FIGS. 2 and 5-8 employ the same reference numbers to denote the same structure.
  • protective overcoats are applied to die wafers that include the first and second die, which can be referred to as a first die wafer and a second die wafer, respectively. More specifically, as illustrated in FIG. 5, a first protective overcoat 212 and a second protective overcoat 224 are applied to a first die wafer 280 that includes the first die 202 and a second die wafer 282 that includes the second die 204, respectively, as illustrated in FIG. 5. Also, the first die 205 overlays a first substrate, such as the first substrate 210, as illustrated in FIG. 5.
  • a first recess is patterned and etched in the first protective overcoat applied to the first die wafer.
  • a backside of the second die wafer is patterned, wherein the pattern on the backside of the second die wafer aligns to patterns on a frontside of the second die wafer.
  • a second recess is etched in a second substrate and an insulating layer on the backside of the second die wafer at a region overlaying the second die.
  • the second recess in the second substrate and the insulating layer is formed with backside processing techniques.
  • the first recess 242 exposes the third metal pad 250 of the first die 202 and the second recess 256 exposes a portion of a metal layer of the second die 204 to provide the fourth metal pad 260.
  • the first die and the second die are singulated from the first die wafer and the second die wafer.
  • the first die and the second die can be singulated with a lasing process or a cutting process.
  • an NCDA layer is applied to the first die, as illustrated by the NCDA layer 226 of FIG. 7.
  • the NCDA layer 226 is applied to a portion of the first protective overcoat 212 of the first die 202 that is spaced apart from the first recess 242.
  • a first metal pad of the first die and a second metal pad on the second die are aligned and the second die is mounted to the NCDA layer and at 425, the second die is adhered to the NCDA layer.
  • the second metal pad 232 is aligned with the first metal pad 230, such that the plane 236 extends through the first metal pad 230 and the second metal pad 232 to form a capacitor.
  • wire bonds are attached to the metal pads exposed by the first and second recesses to form the IC package 200 illustrated in FIG. 2.
  • FIG. 9 illustrates a method 1000 for forming an IC package.
  • the method 1000 could be employed for example, to form the IC package 100 of FIG. 1 and/or the IC package 300 of FIG. 3.
  • the IC package includes a first die and a second die, such as the first die 302 and the second die 304 of FIG. 2.
  • the method 1000 is demonstrated with FIGS. 10-14.
  • FIGS. 10-14 illustrate stages of fabrication of the IC package 300 of FIG. 3.
  • FIGS. 3 and 10-14 employ the same reference numbers to denote the same structure.
  • protective overcoats are applied to die wafers including the first and second die, which can be referred to as a first die wafer and a second die wafer. More specifically, as illustrated in FIG. 10, a first protective overcoat 312 and a second protective overcoat 324 are applied to a first die wafer 380 that includes the first die 302 and a second die wafer 382 that includes the second die 304, respectively. Also, as illustrated in FIG. 10, the first die overlays a first substrate 310. Referring back to FIG. 9, at 1010, a first recess is etched in the first protective overcoat applied to the first wafer that includes the first die.
  • a backside of the second die wafer is patterned, wherein the pattern on the backside of the second die wafer aligns to patterns on a frontside of the second die wafer 282.
  • a second recess is etched in a second substrate and an insulating layer on the backside of the second die wafer in a region overlaying the second die.
  • the second recess in the second substrate and insulating layer is formed with backside processing techniques.
  • the first recess 342 exposes the third metal pad 350 of the first die 302 and the second recess 356 exposes the metal layer of the second die 304 to provide the fourth metal pad 360.
  • the first die and the second die are singulated from the first die wafer and the second die wafer, respectively.
  • the first die and the second die can be singulated with a lasing process or a cutting process.
  • a first NCDA layer is applied to the first die.
  • FIG. 12 illustrates the first NCDA layer 328 applied to the second surface 316 of the first die 302.
  • the first NCDA layer 328 is applied to a portion of the first protective overcoat 312 of the first die 302 that is spaced apart from the first recess 342.
  • a spacer plate is mounted on the first NCDA layer.
  • a second NCDA layer is applied to the spacer plate.
  • FIG. 13 illustrates the spacer plate 326 mounted on the first NCDA layer 328 and the second NCDA layer 330 applied to the spacer plate 326.
  • a first metal pad of the first die and a second metal pad of the second die are aligned.
  • the second die is mounted to the second NCDA layer.
  • the second metal pad 334 is aligned with the first metal pad 332, such that the plane 338 extends through the first metal pad 332 and the second metal pad 334 to form a capacitor.
  • wire bonds are attached to the metal pads exposed by the first recess 342 and the second recess 356 to form the IC package 300 illustrated in FIG. 3.

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  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
PCT/US2020/037482 2019-06-12 2020-06-12 Ic package with multiple dies Ceased WO2020252299A1 (en)

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CN202311075495.XA CN117059500A (zh) 2019-06-12 2020-06-12 具有多个裸片的ic封装
JP2021573729A JP7618594B2 (ja) 2019-06-12 2020-06-12 複数ダイを備えるｉｃパッケージ
CN202080038131.2A CN113853836B (zh) 2019-06-12 2020-06-12 具有多个裸片的ic封装
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US12489088B2 (en) 2025-12-02
US20200395342A1 (en) 2020-12-17
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