JPWO2024070615A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2024070615A5
JPWO2024070615A5 JP2024550001A JP2024550001A JPWO2024070615A5 JP WO2024070615 A5 JPWO2024070615 A5 JP WO2024070615A5 JP 2024550001 A JP2024550001 A JP 2024550001A JP 2024550001 A JP2024550001 A JP 2024550001A JP WO2024070615 A5 JPWO2024070615 A5 JP WO2024070615A5
Authority
JP
Japan
Prior art keywords
lead
semiconductor device
electrode
die pad
exposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024550001A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024070615A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/032962 external-priority patent/WO2024070615A1/ja
Publication of JPWO2024070615A1 publication Critical patent/JPWO2024070615A1/ja
Publication of JPWO2024070615A5 publication Critical patent/JPWO2024070615A5/ja
Pending legal-status Critical Current

Links

JP2024550001A 2022-09-29 2023-09-11 Pending JPWO2024070615A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022155864 2022-09-29
PCT/JP2023/032962 WO2024070615A1 (ja) 2022-09-29 2023-09-11 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024070615A1 JPWO2024070615A1 (https=) 2024-04-04
JPWO2024070615A5 true JPWO2024070615A5 (https=) 2025-06-13

Family

ID=90477520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024550001A Pending JPWO2024070615A1 (https=) 2022-09-29 2023-09-11

Country Status (2)

Country Link
JP (1) JPWO2024070615A1 (https=)
WO (1) WO2024070615A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY133357A (en) * 1999-06-30 2007-11-30 Hitachi Ltd A semiconductor device and a method of manufacturing the same
JP3866127B2 (ja) * 2002-03-20 2007-01-10 株式会社ルネサステクノロジ 半導体装置
JP2021190556A (ja) * 2020-05-29 2021-12-13 ローム株式会社 半導体装置の実装構造
DE112021005639T5 (de) * 2020-12-23 2023-08-03 Rohm Co., Ltd. Verfahren zur herstellung eines halbleiterbauteils und halbleiterbauteils
JP2022118383A (ja) * 2021-02-02 2022-08-15 ローム株式会社 半導体装置

Similar Documents

Publication Publication Date Title
US9685397B2 (en) Semiconductor package with clip structure
KR900005587A (ko) 반도체 디바이스 및 그 제작방법
JP2019192751A (ja) 半導体装置
JP2000307017A5 (https=)
JPH04324662A (ja) 半導体パッケージ
JP2005150647A5 (https=)
KR20050011714A (ko) 휨저항성 기부판을 갖는 전력 반도체 모듈
CN109661724A (zh) 功率模块
JPWO2023021938A5 (https=)
JP2003318360A5 (https=)
JPWO2023100659A5 (https=)
JPWO2024070615A5 (https=)
JPWO2023189650A5 (https=)
KR100975401B1 (ko) 세라믹 패키지
JPWO2023153188A5 (https=)
JPWO2023199808A5 (https=)
JPWO2023162722A5 (https=)
JPWO2022239696A5 (https=)
JP2006294729A (ja) 半導体装置
JPWO2023149257A5 (https=)
JPH0448769A (ja) 半導体装置
JPWO2023100681A5 (https=)
JPWO2022259809A5 (https=)
JP2026059041A (ja) 半導体装置の製造方法および半導体装置
JPWO2024181293A5 (https=)