JPWO2024070615A1 - - Google Patents
Info
- Publication number
- JPWO2024070615A1 JPWO2024070615A1 JP2024550001A JP2024550001A JPWO2024070615A1 JP WO2024070615 A1 JPWO2024070615 A1 JP WO2024070615A1 JP 2024550001 A JP2024550001 A JP 2024550001A JP 2024550001 A JP2024550001 A JP 2024550001A JP WO2024070615 A1 JPWO2024070615 A1 JP WO2024070615A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022155864 | 2022-09-29 | ||
| PCT/JP2023/032962 WO2024070615A1 (ja) | 2022-09-29 | 2023-09-11 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024070615A1 true JPWO2024070615A1 (https=) | 2024-04-04 |
| JPWO2024070615A5 JPWO2024070615A5 (https=) | 2025-06-13 |
Family
ID=90477520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024550001A Pending JPWO2024070615A1 (https=) | 2022-09-29 | 2023-09-11 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024070615A1 (https=) |
| WO (1) | WO2024070615A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY133357A (en) * | 1999-06-30 | 2007-11-30 | Hitachi Ltd | A semiconductor device and a method of manufacturing the same |
| JP3866127B2 (ja) * | 2002-03-20 | 2007-01-10 | 株式会社ルネサステクノロジ | 半導体装置 |
| JP2021190556A (ja) * | 2020-05-29 | 2021-12-13 | ローム株式会社 | 半導体装置の実装構造 |
| DE112021005639T5 (de) * | 2020-12-23 | 2023-08-03 | Rohm Co., Ltd. | Verfahren zur herstellung eines halbleiterbauteils und halbleiterbauteils |
| JP2022118383A (ja) * | 2021-02-02 | 2022-08-15 | ローム株式会社 | 半導体装置 |
-
2023
- 2023-09-11 JP JP2024550001A patent/JPWO2024070615A1/ja active Pending
- 2023-09-11 WO PCT/JP2023/032962 patent/WO2024070615A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024070615A1 (ja) | 2024-04-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250228 |